WIRE BOND AND DIE ATTACH US MICROWAVES SPIRAL CHIP INDUCTORS APPLICATION NOTE USM 102 Inductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized. DIE ATTACH Spiral chip inductors are NOT metallized on the backside unless special requested. The spiral inductors when mounted on top of an other dielectric, will have the highest self resonance frequency. Spiral chip inductors should be die attached with nonconductive epoxy on top of an other dielectric CLEANING RECOMMENDATIONS After epoxy die attach and epoxy cure, the spiral chip inductors should always be plasma clean prior to wire bonding operation. WIRE BONDING Wire leads should be attached to the chip and the substrate by use of thermo compression bonding. This method involves pressuring the gold lead against the gold metallized area on the chip or substrate under proper conditions of heat pressure and scrub to effect a bond. 1 mil gold wire is recommended (see Fig.1.)

 
 
US MICROWAVES
Advanced Microwave Components
WIRE BOND AND DIE ATTACH US MICROWAVES SPIRAL CHIP INDUCTORS
 
 

APPLICATION NOTE USM 102 Author: Mihaela Radulescu, M Phys. Sc.
member technical staff, SEMICONIX CORPORATION
HANDLING

Inductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. The use of plastic tipped tweezers or vacuum pick-ups is strongly recommended for individual components. Bulk handling should ensure that abrasion and mechanical shock are minimized.

DIE ATTACH

Spiral chip inductors are NOT metallized on the backside unless special requested. The spiral inductors when mounted on  top of an other dielectric, will have the highest self resonance frequency. Spiral chip inductors should be die attached with nonconductive epoxy on top of an other dielectric

CLEANING RECOMMENDATIONS

After epoxy die attach and epoxy cure, the spiral chip inductors should always  be plasma clean prior to wire bonding operation.

WIRE BONDING

Wire leads should be attached to the chip and the substrate by use of thermo compression bonding. This method involves pressuring the gold lead against the gold metallized area on the chip or substrate under proper conditions of heat pressure and scrub to effect a bond. 1 mil gold wire is recommended (see Fig.1.)

how to wire spiral chip inductors
Fig.1 How to wire bond spiral chip inductors


Last updated: July 01, 2009
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