HANDLING
Inductor chips should be handled with care to avoid damage or contamination from
perspiration and skin oils. The use of plastic tipped tweezers or vacuum
pick-ups is strongly recommended for individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized.
DIE ATTACH
Spiral chip inductors
are NOT metallized on the backside unless special requested. The spiral
inductors when mounted on top of an other dielectric, will have the
highest self resonance frequency. Spiral chip inductors should be die attached with
nonconductive epoxy on top of an other dielectric
CLEANING
RECOMMENDATIONS
After epoxy die
attach and epoxy cure, the spiral chip inductors should always be plasma
clean prior to wire bonding operation.
WIRE BONDING
Wire leads should be attached to the chip and the substrate by use of thermo compression bonding. This method involves pressuring the gold lead against the gold metallized area on the chip or substrate under proper conditions of heat pressure and scrub to effect a bond. 1 mil gold wire is recommended (see Fig.1.)
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Fig.1 How to wire bond spiral chip inductors
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