Flangeless power chip resistors are designed for critical designs where space is at premium. The flangeless power chip resistors can be die attached to the heat sink or to a base plate using AuSn or AuGe preforms. Since the power chip resistors do not have terminals, they have to be attached using gold ribbon via gap welding after the backside is soldered in place. Backside metallization for power chip resistors is Ti/Pt/Au which is also compatible with Sn solder . For the more common SnPb, a Ti/Ni/Au backside metallization should be requested.

US MICROWAVES Advanced Microwave Components	MOUNTING FLANGE LESS POWER CHIP RESISTORS

Flangeless power chip resistors are designed for critical designs where space is at premium. The flangeless power chip resistors can be die attached to the heat sink or to a base plate using AuSn or AuGe preforms. Since the power chip resistors do not have terminals, they have to be attached using gold ribbon via gap welding after the backside is soldered in place. Backside metallization for power chip resistors is Ti/Pt/Au which is also compatible with Sn solder . For the more common SnPb, a Ti/Ni/Au backside metallization should be requested.

Home>Application Notes>	Last updated: May 12, 2007
US MICROWAVES 2968 Scott Blvd. Santa Clara, CA 95054-3322 USA Tel:(408)986-8026 Fax:(408)986-8027

©1990-2008 US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.