HIGH VOLTAGE NIP DIODE USM NIP-500D FEATURES APPLICATIONS DIODE Max. Voltage 500V@10A Attenuators, limiters, phase switching, power switches. PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USM NIP-500D NIP DIODES are manufactured from high resistivity silicon substrates with N++ and P++ diffusions for ohmic contacts. The active areas are protected with high reliability glass or oxide/nitride passivation. USM NIP-500D is available in die form only. The die size is 42x42mils (+2mils,-5mils). The die thickness is 11 mils2mils. The top bond pad metallization is 20mils diameter and is coated with USM standard 1m GOLD, compatible with ultrasonic and thermo compression bonding of gold wire or gold ribbon. The backside of the die is coated with 1.0m GOLD over platinum, which makes it compatible with AuSn or AuGe die attach. The dies are tested and 100% visual inspected according to space and military visual criteria. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. MAXIMUM RATINGS (@ 25 C) PARAMETER SYMBOL USMSMS3922 UNITS DC Reverse Breakdown Voltage@10A VB 500 V Operating and Storage Junction Temperature (Reverse Voltage applied) Top,Tstg -65 to +150 C Junction temperature TJ +150 C Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty. ELECTRICAL SPECIFICATIONS (@ 25 C) PARAMETER SYMBOL USMSMS3922 UNITS Reverse Voltage@10A VB 500 V Series resistance@50mA(measured at 1GHz using transmission loss techniques) RS typ.0.45 W Carrier lifetime TI typ.2 s Junction capacitance at -40V,1MHz Cj typ.0.35 pF GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal Si - Silicon 111 42x423 The top bond pad metallization is 20mils diameter and is coated with USM standard 1m GOLD, compatible with ultrasonic and thermo compression bonding of gold wire or gold ribbon. The backside of the die is coated with 1.0m GOLD over platinum, which makes it compatible with AuSn or AuGe die attach. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). DIE LAYOUT - MECHANICAL SPECIFICATIONS STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST USM PART # ORDER QUANTITY waffle pack U/P($) USMNIP500D 100pc USMNIP500D 1,000pc USMNIP500D 5,000pc List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail USMSR220-WP USMSR230-WP USMSR240-WP USMSR250-WP USMSR260-WP ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

 
 
US MICROWAVES
Advanced Microwave Components
  HIGH VOLTAGE NIP DIODE
USM NIP-500D
 
 

FEATURES
APPLICATIONS
DIODE
Max. Voltage 500V@10µA
Attenuators, limiters, phase switching, power switches.

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
USM NIP-500D NIP DIODES are manufactured from high resistivity silicon substrates with N++ and P++ diffusions for ohmic contacts. The active areas are protected with high reliability glass or oxide/nitride passivation. USM NIP-500D is available in die form only. The die size is 42x42mils (+2mils,-5mils). The die thickness is 11 mils±2mils. The top bond pad metallization is 20mils diameter and is coated with USM standard 1µm GOLD, compatible with ultrasonic and thermo compression bonding of gold wire or gold ribbon. The backside of the die is coated with 1.0µm GOLD over platinum, which makes it compatible with AuSn or AuGe die attach. The dies are tested and 100% visual inspected according to space and military visual criteria.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

MAXIMUM RATINGS (@ 25 °C)
PARAMETER SYMBOL USMSMS3922 UNITS
DC Reverse Breakdown Voltage@10µA VB 500 V
Operating and Storage Junction Temperature (Reverse Voltage applied) Top,Tstg -65 to +150 °C
Junction temperature TJ +150 °C
Performance is guaranteed only under the conditions listed in the specifications table and is not guaranteed under the full range(s) described by the Absolute Maximum specifications. Exceeding any of the absolute maximum/minimum specifications may result in permanent damage to the device and will void the warranty.

ELECTRICAL SPECIFICATIONS (@ 25 °C)
PARAMETER SYMBOL USMNIP500D UNITS
Reverse Voltage@10µA VB 500 V
Series resistance@50mA(measured at 1GHz using transmission loss techniques) RS typ.0.45 W
Carrier lifetime TI typ.2 µs
Junction capacitance at -40V,1MHz Cj typ.0.35 pF

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
Si - Silicon 11±1 42x42±3 The top bond pad metallization is 20mils diameter and is coated with USM standard 1µm GOLD, compatible with ultrasonic and thermo compression bonding of gold wire or gold ribbon. The backside of the die is coated with 1.0µm GOLD over platinum, which makes it compatible with AuSn or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT - MECHANICAL SPECIFICATIONS
 

STANDARD PRODUCTS ORDERING INFORMATION


STANDARD PRODUCTS PRICE LIST
USM PART # ORDER QUANTITY U/P($)
USMNIP500D-WP 100pc  
USMNIP500D-WP 1,000pc  
USMNIP500D-WP 5,000pc  
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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