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HSKALNI05xxxyyy - 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks - High heat transfer rate, High thermal conductivity Aluminium Nitride heat sinks and stand offs manufactured by US Microwaves
HSKALNI05xxxyyy,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers
HSKALNI05xxxyyy - 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks - High heat
transfer rate, High thermal conductivity Aluminium Nitride heat sinks and stand offs manufactured by US Microwaves
HSKALNI05xxxyyy,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium
oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal
shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers US MICROWAVES 5 mils thick
gold coated thin film Aluminium Nitride Isolated heat sinks Advanced Microwave Components HSKALNI05xxxyyy FEATURES
APPLICATIONS AlN Isolated Heat Sink High heat transfer rate High thermal conductivity Very good thermal contact Very
good thermal shock resistance Microwave hybrid circuits Mount for GaAs microwave active devices Solid state RF power
amplifiers 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05xxxyyy HSKALNI05xxxyyy
Aluminium Nitride Isolated Heat Sink PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The HSKALNI05xxxyyy series of
microwave 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks is designed to be used in microwave
hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and
workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. TECHNOLOGY
DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced
semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold
interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability.
Thin film technology is the preferred solution for all applications that require low noise, long term stability and
excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition
of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are
available in die form and are ideal for high reliability hybrid and multi chip module applications. HSKALNI05xxxyyy
Aluminium Nitride Isolated Heat Sink ELECTRICAL/MECHANICAL CHARACTERISTICS LENGTH [mils] WIDTH [mils] PARAMETER SYMBOL
VALUE UNITS - - Thickness T 5 mils 10 10 Thermal Resistance Rth 1.16E-02 K/W Power dissipation (ΔT=1°C) P 61 W DC
Resistance DCR ∞ Ω 20 10 Thermal Resistance Rth 5.79E-03 K/W Power dissipation (ΔT=1°C) P 122 W DC Resistance DCR ∞ Ω
30 10 Thermal Resistance Rth 3.86E-03 K/W Power dissipation (ΔT=1°C) P 183 W DC Resistance DCR ∞ Ω 20 20 Thermal
Resistance Rth 2.89E-03 K/W Power dissipation (ΔT=1°C) P 244 W DC Resistance DCR ∞ Ω 40 20 Thermal Resistance Rth
1.45E-03 K/W Power dissipation (ΔT=1°C) P 489 W DC Resistance DCR ∞ Ω 60 20 Thermal Resistance Rth 9.65E-04 K/W Power
dissipation (ΔT=1°C) P 733 W DC Resistance DCR ∞ Ω 30 30 Thermal Resistance Rth 1.29E-03 K/W Power dissipation (ΔT=1°C)
P 550 W DC Resistance DCR ∞ Ω 60 30 Thermal Resistance Rth 6.43E-04 K/W Power dissipation (ΔT=1°C) P 1099 W DC
Resistance DCR ∞ Ω 120 30 Thermal Resistance Rth 3.22E-04 K/W Power dissipation (ΔT=1°C) P 2198 W DC Resistance DCR ∞ Ω
40 40 Thermal Resistance Rth 7.24E-04 K/W Power dissipation (ΔT=1°C) P 977 W DC Resistance DCR ∞ Ω 80 40 Thermal
Resistance Rth 3.62E-04 K/W Power dissipation (ΔT=1°C) P 1954 W DC Resistance DCR ∞ Ω 120 40 Thermal Resistance Rth
2.41E-04 K/W Power dissipation (ΔT=1°C) P 2931 W DC Resistance DCR ∞ Ω 160 40 Thermal Resistance Rth 1.81E-04 K/W Power
dissipation (ΔT=1°C) P 3908 W DC Resistance DCR ∞ Ω ONLY Proper die handling equipment and procedures should be
employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. HSKALNI05xxxyyy
Aluminium Nitride Isolated Heat Sink GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] AlN Aluminium
Nitride 5±0.5 L x W ±2 Frontside metal Backside metal The front side metallization is min 3µm thick, 99.99%
electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Custom
metallization is available for special orders. The backside metallization is min 3µm thick, 99.99% electroplated gold
with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Custom metallization is available
for special orders. 10x10 mils, 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks
HSKALNI05010010 20x10 mils, 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05020010
30x10 mils, 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05030010 20x20 mils, 5 mils
thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05020020 40x20 mils, 5 mils thick gold coated
thin film Aluminium Nitride Isolated heat sinks HSKALNI05040020 60x20 mils, 5 mils thick gold coated thin film
Aluminium Nitride Isolated heat sinks HSKALNI05060020 30x30 mils, 5 mils thick gold coated thin film Aluminium Nitride
Isolated heat sinks HSKALNI05030030 60x30 mils, 5 mils thick gold coated thin film Aluminium Nitride Isolated heat
sinks HSKALNI05060030 120x30 mils, 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks
HSKALNI05120030 40x40 mils, 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05040040
80x40 mils, 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05080040 120x40 mils, 5
mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05120040 160x40 mils, 5 mils thick gold
coated thin film Aluminium Nitride Isolated heat sinks HSKALNI05160040 All US Microwaves Aluminium Nitride Isolated
Heat Sink products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs,
delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices
for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). Aluminium Nitride
Isolated Heat Sink STANDARD PRODUCTS ORDERING INFORMATION 5 mills Aluminium Nitride Isolated Heat Sink STANDARD
PRODUCTS PRICE LIST LENGTH [mils] WIDTH [mils] US MICROWAVES PART NUMBER WAFFLE PACKS MINIM ORDER QTY U/P [$] 10 10
HSKALNI05010010 -WP 964 $1.328 20 10 HSKALNI05020010 -WP 880 $1.455 30 10 HSKALNI05030010 -WP 812 $1.576 20 20
HSKALNI05020020 -WP 784 $1.633 40 20 HSKALNI05040020 -WP 644 $1.988 60 20 HSKALNI05060020 -WP 548 $2.336 30 30
HSKALNI05030030 -WP 628 $2.038 60 30 HSKALNI05060030 -WP 472 $2.712 120 30 HSKALNI05120030 -WP 316 $4.051 40 40
HSKALNI05040040 -WP 504 $2.54 80 40 HSKALNI05080040 -WP 352 $3.636 120 40 HSKALNI05120040 -WP 268 $4.776 160 40
HSKALNI05160040 -WP 220 $5.818 HSKALNI05xxxyyy Aluminium Nitride Isolated Heat Sink: Products sold for space, military
or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be
established on a case by case basis. For any special applications, die level KGD qualification requirements, different
packaging or custom configurations, contact sales department. HSKALNI05xxxyyy Aluminium Nitride Isolated Heat Sink
INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Aluminium Nitride Isolated Heat Sink may be ordered on line
HERE. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line.
On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before,
becoming non cancelable binding contracts. DELIVERY: Typical delivery for Aluminium Nitride Isolated Heat Sink products
packaged in waffle packs is 2-4 weeks ARO. For Aluminium Nitride Isolated Heat Sink Custom designs, delivery is 3-5
weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All Aluminium
Nitride Isolated Heat Sink devices for chip and wire applications are 100% tested, visual inspected and shipped in
waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may
vary. For high volume automated assembly, Aluminium Nitride Isolated Heat Sink devices may be supplied as 4" wafers
100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples of Aluminium Nitride Isolated Heat Sink are
available only for customers that have issued firm orders pending qualification of product in a particular application.
GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all Aluminium Nitride Isolated Heat
Sink standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this
information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any
infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise
the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should
not be used within support systems which are intended for surgical implants into the body, to support or sustain life,
in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S.
Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US
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