HSKBEOxxxx-10 THICK GOLD COATED THIN FILM Beryllium Oxide Isolated HEAT SINKS manufacutred by US Microwaves

HSKBEOxxxx-10 THICK GOLD COATED THIN FILM Beryllium Oxide Isolated HEAT SINKS manufacutred by US Microwaves HSKBEOxxxx-10 THICK GOLD COATED THIN FILM Beryllium Oxide Isolated HEAT SINKS manufacutred by US Microwaves HSKBEOxxxx-10 THICK GOLD COATED THIN FILM Beryllium Oxide Isolated HEAT SINKS manufacutred by US Microwaves US MICROWAVESAdvanced Microwave Components THICK GOLD COATED THIN FILM BERYLLIUM OXIDE ISOLATED HEAT SINKSHSKBEOxxxx-10 FEATURES APPLICATIONS HEAT SINK High heat transfer rate Very good thermal contact very good thermal shock resistance high thermal conductivity Microwave hybrid circuits Mount for GaAs microwave active devices Solid state RF power amplifiers PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The HSKBEOxxxx-10 series of microwave thin film Beryllium Oxide heatsinks is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL-MECHANICAL CHARACTERISTICS L [mils]W [mils]Thermal ResistanceUNITSPower dissipationUNITS 101014.06°C/W0.071W 20107.03°C/W0.142W 30104.69°C/W0.213W 20203.52°C/W0.284W 40201.76°C/W0.569W 60201.17°C/W0.853W 30301.56°C/W0.640W 60300.78°C/W1.28W 120300.39°C/W2.56W 40400.88°C/W1.14W 80400.44°C/W2.28W 120400.29°C/W3.41W 160400.22°C/W4.55W SUBSTRATE-PROCESS INFORMATION SubstrateThickness (mils)Device size (mils)Frontside metal Backside metal Beryllium OxideBeO10±1L x W ±3The front side metallization is min 3m thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Custom metallization is available for special orders.The backside metallization is min 3m thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Custom metallization is available for special orders. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). DIE LAYOUT - MECHANICAL SPECIFICATIONS STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST USM PART #W [mil] L [mil] Waffle PacksMINIMUM ORDER QUANTITYU/P($) HSKBEO10001010-WP241pc$1.328 HSKBEO10201020-WP220pc$1.455 HSKBEO10301030-WP203pc$1.576 HSKBEO20002020-WP196pc$1.633 HSKBEO20402040-WP161pc$1.988 HSKBEO20602060-WP137pc$2.336 HSKBEO30003030-WP157pc$2.038 HSKBEO30603060-WP118pc$2.712 HSKBEO3012030120-WP79pc$4.051 HSKBEO40004040-WP126pc$2.540 HSKBEO40804080-WP88pc$3.636 HSKBEO4012040120-WP67pc$4.776 HSKBEO4016040160-WP55pc$5.818 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/NQuantityE-mail HSKBEO1000-10HSKBEO1020-10HSKBEO1030-10HSKBEO2000-10HSKBEO2040-10HSKBEO2060-10HSKBEO3000-10HSKBEO3060-10HSKBEO30120-10HSKBEO4000-10HSKBEO4080-10HSKBEO40120-10HSKBEO40160-10 ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. HomeProduct TreeTech. SupportPrint PDFRequest QuoteInventoryPlace OrderContact sales Last updated: US MICROWAVES 2968 Scott Blvd. Santa Clara, CA 95054-3322 USA Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.



US MICROWAVES Advanced Microwave Components		THICK GOLD COATED THIN FILM BERYLLIUM OXIDE ISOLATED HEAT SINKS HSKBEOxxxx-10

FEATURES

APPLICATIONS

HEAT SINK

High heat transfer rate
Very good thermal contact
Very good thermal shock resistance
High thermal conductivity

Microwave hybrid circuits
Mount for GaAs microwave active devices
Solid state RF power amplifiers

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

The HSKBEOxxxx-10 series of microwave thin film Beryllium Oxide heatsinks is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING

All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

ELECTRICAL-MECHANICAL CHARACTERISTICS
L [mils]	W [mils]	Thermal Resistance	UNITS	Power dissipation	UNITS
10	10	14.06	°C/W	0.071	W
20	10	7.03	°C/W	0.142	W
30	10	4.69	°C/W	0.213	W
20	20	3.52	°C/W	0.284	W
40	20	1.76	°C/W	0.569	W
60	20	1.17	°C/W	0.853	W
30	30	1.56	°C/W	0.640	W
60	30	0.78	°C/W	1.28	W
120	30	0.39	°C/W	2.56	W
40	40	0.88	°C/W	1.14	W
80	40	0.44	°C/W	2.28	W
120	40	0.29	°C/W	3.41	W
160	40	0.22	°C/W	4.55	W

SUBSTRATE-PROCESS INFORMATION
Substrate	Thickness (mils)	Device size (mils)	Frontside metal	Backside metal
Beryllium Oxide BeO	10±1	L x W ±3	The front side metallization is min 3m thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Custom metallization is available for special orders.	The backside metallization is min 3m thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. Custom metallization is available for special orders.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT - MECHANICAL SPECIFICATIONS

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART #	W [mil]	L [mil]	Waffle Packs	MINIMUM ORDER QUANTITY	U/P($)
HSKBEO1000	10	10	-WP	241pc	$1.328
HSKBEO1020	10	20	-WP	220pc	$1.455
HSKBEO1030	10	30	-WP	203pc	$1.576
HSKBEO2000	20	20	-WP	196pc	$1.633
HSKBEO2040	20	40	-WP	161pc	$1.988
HSKBEO2060	20	60	-WP	137pc	$2.336
HSKBEO3000	30	30	-WP	157pc	$2.038
HSKBEO3060	30	60	-WP	118pc	$2.712
HSKBEO30120	30	120	-WP	79pc	$4.051
HSKBEO4000	40	40	-WP	126pc	$2.540
HSKBEO4080	40	80	-WP	88pc	$3.636
HSKBEO40120	40	120	-WP	67pc	$4.776
HSKBEO40160	40	160	-WP	55pc	$5.818
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Last updated: May 12, 2007

US MICROWAVES 2968 Scott Blvd. Santa Clara, CA 95054-3322 USA Tel:(408)986-8026 Fax:(408)986-8027

INSTANT QUOTE
US Microwaves P/N	Quantity	E-mail