SILICON ELECTRICALLY CONDUCTIVE HEAT SINKS HSKSIC-xxxx-05 5 mils thick gold coated thin film SILICON CONDUCTIVE heat sinks and stand offs HSKSIC-xxxx-10 10 mils thick gold coated thin film SILICON CONDUCTIVE heat sinks and stand offs The HSKSICxxxx-TT series of microwave thin film silicon stand offs is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. US MICROWAVES, manufacturer of high reliability microwave integrated circuits  MIC technology. US Microwave offers a multitude of applied thin film products and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices  for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.

 


US MICROWAVES
Advanced Microwave Components
SILICON ELECTRICALLY CONDUCTIVE HEAT SINKS
HSKSIC-xxxx-05 5 mils thick gold coated thin film SILICON  CONDUCTIVE heat sinks and stand offs
HSKSIC-xxxx-10 10 mils thick gold coated thin film SILICON  CONDUCTIVE heat sinks and stand offs
 
   
 
The HSKSICxxxx-TT series of microwave thin film silicon stand offs is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs.

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