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HSKSIC05xxxyyy - 5 mils thick gold coated thin film Silicon Electrically Conductive heat sinks - High heat transfer rate, High thermal conductivity Silicon heat sinks and stand offs manufactured by US Microwaves
HSKSIC05xxxyyy,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers
HSKSIC05xxxyyy - 5 mils thick gold coated thin film Silicon Electrically Conductive heat sinks - High heat
transfer rate, High thermal conductivity Silicon heat sinks and stand offs manufactured by US Microwaves
HSKSIC05xxxyyy,Heat sinks, stand offs, bonding islands, isolated, electrically conductive,aluminum nitride, beryllium
oxide,silicon, copper,heat transfer rate,thermal conductivity,thermal contact,thermal resistance,thermal
shock,microwave hybrid circuits,GaAs microwave active devices,solid state power amplifiers US MICROWAVES 5 mils thick
gold coated thin film Silicon Electrically Conductive heat sinks Advanced Microwave Components HSKSIC05xxxyyy FEATURES
APPLICATIONS Si Electrically Conductive Heat Sink High heat transfer rate High thermal conductivity Very good thermal
contact Very good thermal shock resistance Electrically conductive [DC short] Microwave hybrid circuits Mount for GaAs
microwave active devices Solid state RF power amplifiers 5 mils thick gold coated thin film Silicon Electrically
Conductive heat sinks HSKSIC05xxxyyy HSKSIC05xxxyyy Silicon Electrically Conductive Heat Sink PRODUCT DESCRIPTION AND
SHORT APPLICATION NOTE The HSKSIC05xxxyyy series of microwave 5 mils thick gold coated thin film Silicon Electrically
Conductive heat sinks is designed to be used in microwave hybrid circuits. These devices can be used over the full
military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual
inspected and packaged in waffle packs. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR - THIN FILM MANUFACTURING All thin film
microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and
self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve
excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications
that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs
proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from
1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and
multi chip module applications. HSKSIC05xxxyyy Silicon Electrically Conductive Heat Sink ELECTRICAL/MECHANICAL
CHARACTERISTICS LENGTH [mils] WIDTH [mils] PARAMETER SYMBOL VALUE UNITS - - Thickness T 5 mils 10 10 Thermal Resistance
Rth 1.31E-02 K/W Power dissipation (ΔT=1°C) P 54 W DC Resistance DCR 3.13 mΩ 20 10 Thermal Resistance Rth 6.56E-03 K/W
Power dissipation (ΔT=1°C) P 108 W DC Resistance DCR 2.08 mΩ 30 10 Thermal Resistance Rth 4.37E-03 K/W Power
dissipation (ΔT=1°C) P 162 W DC Resistance DCR 1.56 mΩ 20 20 Thermal Resistance Rth 3.28E-03 K/W Power dissipation
(ΔT=1°C) P 216 W DC Resistance DCR 1.56 mΩ 40 20 Thermal Resistance Rth 1.64E-03 K/W Power dissipation (ΔT=1°C) P 431 W
DC Resistance DCR 1.04 mΩ 60 20 Thermal Resistance Rth 1.09E-03 K/W Power dissipation (ΔT=1°C) P 647 W DC Resistance
DCR 0.78 mΩ 30 30 Thermal Resistance Rth 1.46E-03 K/W Power dissipation (ΔT=1°C) P 485 W DC Resistance DCR 1.04 mΩ 60
30 Thermal Resistance Rth 7.29E-04 K/W Power dissipation (ΔT=1°C) P 970 W DC Resistance DCR 0.69 mΩ 120 30 Thermal
Resistance Rth 3.65E-04 K/W Power dissipation (ΔT=1°C) P 1940 W DC Resistance DCR 0.42 mΩ 40 40 Thermal Resistance Rth
8.20E-04 K/W Power dissipation (ΔT=1°C) P 862 W DC Resistance DCR 0.78 mΩ 80 40 Thermal Resistance Rth 4.10E-04 K/W
Power dissipation (ΔT=1°C) P 1724 W DC Resistance DCR 0.52 mΩ 120 40 Thermal Resistance Rth 2.73E-04 K/W Power
dissipation (ΔT=1°C) P 2586 W DC Resistance DCR 0.39 mΩ 160 40 Thermal Resistance Rth 2.05E-04 K/W Power dissipation
(ΔT=1°C) P 3448 W DC Resistance DCR 0.31 mΩ ONLY Proper die handling equipment and procedures should be employed.
Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. HSKSIC05xxxyyy Silicon
Electrically Conductive Heat Sink GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Si Silicon 5±0.5 L x W
±2 Frontside metal Backside metal The front side metallization is min 3µm thick, 99.99% electroplated gold with a TiW
barrier that withstands >30 min at 400°C in air without loss of adhesion. Custom metallization is available for special
orders. The backside metallization is min 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands >30
min at 400°C in air without loss of adhesion. Custom metallization is available for special orders. 10x10 mils, 5 mils
thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC05010010 20x10 mils, 5 mils thick gold
coated thin film Silicon Electrically Conductive heat sinks HSKSIC05020010 30x10 mils, 5 mils thick gold coated thin
film Silicon Electrically Conductive heat sinks HSKSIC05030010 20x20 mils, 5 mils thick gold coated thin film Silicon
Electrically Conductive heat sinks HSKSIC05020020 40x20 mils, 5 mils thick gold coated thin film Silicon Electrically
Conductive heat sinks HSKSIC05040020 60x20 mils, 5 mils thick gold coated thin film Silicon Electrically Conductive
heat sinks HSKSIC05060020 30x30 mils, 5 mils thick gold coated thin film Silicon Electrically Conductive heat sinks
HSKSIC05030030 60x30 mils, 5 mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC05060030
120x30 mils, 5 mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC05120030 40x40 mils, 5
mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC05040040 80x40 mils, 5 mils thick
gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC05080040 120x40 mils, 5 mils thick gold coated
thin film Silicon Electrically Conductive heat sinks HSKSIC05120040 160x40 mils, 5 mils thick gold coated thin film
Silicon Electrically Conductive heat sinks HSKSIC05160040 All US Microwaves Silicon Electrically Conductive Heat Sink
products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is
3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and
wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). Silicon Electrically Conductive
Heat Sink STANDARD PRODUCTS ORDERING INFORMATION 5 mills Silicon Electrically Conductive Heat Sink STANDARD PRODUCTS
PRICE LIST LENGTH [mils] WIDTH [mils] US MICROWAVES PART NUMBER WAFFLE PACKS MINIM ORDER QTY U/P [$] 10 10
HSKSIC05010010 -WP 241 $1.328 20 10 HSKSIC05020010 -WP 220 $1.455 30 10 HSKSIC05030010 -WP 203 $1.576 20 20
HSKSIC05020020 -WP 196 $1.633 40 20 HSKSIC05040020 -WP 161 $1.988 60 20 HSKSIC05060020 -WP 137 $2.336 30 30
HSKSIC05030030 -WP 157 $2.038 60 30 HSKSIC05060030 -WP 118 $2.712 120 30 HSKSIC05120030 -WP 79 $4.051 40 40
HSKSIC05040040 -WP 126 $2.54 80 40 HSKSIC05080040 -WP 88 $3.636 120 40 HSKSIC05120040 -WP 67 $4.776 160 40
HSKSIC05160040 -WP 55 $5.818 HSKSIC05xxxyyy Silicon Electrically Conductive Heat Sink: Products sold for space,
military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order
levels to be established on a case by case basis. For any special applications, die level KGD qualification
requirements, different packaging or custom configurations, contact sales department. HSKSIC05xxxyyy Silicon
Electrically Conductive Heat Sink INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Silicon Electrically
Conductive Heat Sink may be ordered on line HERE. A copy of the order along with an order confirmation receipt is
issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US
Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery
for Silicon Electrically Conductive Heat Sink products packaged in waffle packs is 2-4 weeks ARO. For Silicon
Electrically Conductive Heat Sink Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock
with delivery up to 1 week. SHIPPING/PACKAGING: All Silicon Electrically Conductive Heat Sink devices for chip and wire
applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can
be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, Silicon Electrically
Conductive Heat Sink devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples of Silicon Electrically Conductive Heat Sink are available only for customers that have issued firm
orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees
continuous supply and availability of all Silicon Electrically Conductive Heat Sink standard products provided minimum
order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible.
However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third
parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product
line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support
systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space
equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home
Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.usmicrowaves.com Tel:(408)986-8026 Fax:(408)986-8027 ©1990- US MICROWAVES All rights reserved. No
material from this site may be used or reproduced without permission.
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