| Heatsink. Silicon Heatsinks for microwave chip and wire hybrid circuits assembly. These heat sinks are electrically isolated and can be used also as bonding islands and/or zero ohm jumpers.HSKSICxxxx-25 series of microwave thin film silicon stand offs is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. |
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MICROWAVE THIN FILM SILICON HEATSINKS
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| The HSKSICxxxx-10 series of microwave thin film silicon stand offs is designed to be used in microwave hybrid circuits. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Level B. Devices are 100% visual inspected and packaged in waffle packs. | ![]() |
| SUBSTRATE INFORMATION | |||
| Material | Thickness T (mil) | Power disspation (W) | Resistance (mW) |
| Si, 99.6%, SiO 10kA front side only | 10±1 | xx | xx |
| PROCESS INFORMATION | |
| Front side metallization | Backside metallization |
| The front side metallization is min 3m thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. | The backside metallization is min 3m thick, 99.99% electroplated gold with a TiW barrier that withstands >30 min at 400°C in air without loss of adhesion. |
| ORDERING INFORMATION HSKSICxxxx-10 |
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