The USM CS52015 series of positive adjustable and fixed regulators are designed to provide 1.5A with higher efficiency than currently available devices. All internal circuitry is designed to operate down to 700mV input to output differential and the dropout voltage is fully specified as a function of load current. Dropout voltage of the device is 100mV at light loads and rising to 700mV at maximum output current. A second low current input is required to achieve this dropout. The USM CS52015 can also be used as a single supply device (3 pin version). On-chip trimming adjusts the reference voltage to 1%. Ajustable or Fixed Output Output Current of 1.5A Low Dropout 700mV at 1.5A Output Current 0.04% Line Regulation 0.1% Load regulation 100% Trermal limit Burn-In Fast Transient Response Remote sense High Eficiency Linear Regulators Post Regulators for Swiching Supplies

 
 
US MICROWAVES
Advanced Microwave Components
  AJUSTABLE LINEAR REGULATOR
USM CS52015
 
 

FEATURES
APPLICATIONS
LDO VOLTAGE REGULATOR
Output Current to 1.5 A
Output Accuracy to ±1.0% Over Temperature
Dropout Voltage (typical) 1.05 V @ 1.5 A
Fast Transient Response
Fault Protection:–Current Limit Thermal Shutdown
In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS.

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The USM CS52015 linear regulator provides 1.5 A with an accuracy of ±1.0 %. The device uses two external resistors to set the output voltage within a 1.25 V to 5.5 V range. The regulator is intended for use as a post regulator and microprocessor supply. The fast loop response and low dropoutvoltage make this regulator ideal for applications where low voltage operation and good transient response are important.


IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNITS
Supply Voltage VCC 7.0 V
Operating Temperature Range   -40 to +70 °C
Junction Temperature   150 °C
Storage Temperature Range   -60 to +150 °C
Lead Temperature Soldering: Wave Solder (through hole styles only) Note 1.
Reflow (SMD styles only) Note 2.
  260 Peak
230 Peak
°C
ESD Damage Threshold   2.0 kV
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.
(NOTE 1) 10 second maximum.
(NOTE 2) 60 second maximum above 183°C

ELECTRICAL CHARACTERISTIC
(CIN = 10 F, COUT = 22 F Tantalum, VOUT + VDROPOUT < VIN < 7.0 V, 0°C =< TA =<70°C,
J =< +150°C, unless otherwise specified, Ifull load = 1.5 A)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Reference Voltage
(Notes 3. and 4.)
VIN – VOUT = 1.5 V; VAdj = 0 V
10 mA =< IOUT =< 1.5 A
1.241
(–1.0%)
1.254
1.266
(+1.0%)
V
Line Regulation 1.5 V =< VIN –VOUT =< 5.75 V;
IOUT = 10 mA
  0.02
0.20
%
Load Regulation
(Notes 3. and 4.)
VIN – VOUT = 1.5 V;
10 mA =< IOUT =< 1.5 A
  0.04

0.4

%
Dropout Voltage (Note 5.) VOUT = 1.5 A   1.05 1.4 V
Current Limit VIN – VOUT = 3.0 V; TJ >= 25°C 1.6 3.1   A
Minimum Load Current (Note 6.) VIN = 7.0 V, VAdj = 0 V   0.6 2.0 mA
Adjust Pin Current VIN – VOUT = 3.0 V; IOUT = 10 mA   50 100 µA
Thermal Regulation (Note 7.) 30 ms Pulse, TA = 25°C   0.002 0.020 %/W
Ripple Rejection (Note 7.) f = 120 Hz; IOUT = 1.5 A;
VIN – VOUT = 3.0 V;
VRIPPLE = 1.0 VPP
      dB
Thermal Shutdown (Note 8.)   150 210 210 °C
Thermal Shutdown Hysteresis (Note 8)         °C
 
(NOTE 3) Load regulation and output voltage are measured at a constant junction temperature by low duty cycle pulse testing. Changes in output voltage due to temperature changes must be taken into account seperately.
(NOTE 4) Specifications apply for an external Kelvin sense connection at a point on the output pin 1/4” from the bottom of the package.
(NOTE 5) Dropout voltage is a measurement of the minimum input/output differential at full load.
(NOTE 6) The minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor divider used to set the output voltage is selected to meet the minimum requirement.
(NOTE 7) Guaranteed by design, not 100% tested in production.
(NOTE 8) Thermal shutdown is 100% functionally tested in production.

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) [mm] Bonding pads Backside metal
Silicon 10±1 (78.74x75.98)[2.00x1.93] min 5.512x5.512 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING
These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1µm Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD # FUNCTION X(mm) X(mils) Y(mm) Y(mils)
1 Output 0.170 6.693 1.760 69.291
2 Output 1.830 72.047 1.760 69.291
3 Vpower 1.000 39.370 1.475 58.071
4 VControl 0.816 32.126 1.165 45.866
5 Sense 0.170 6.693 0.675 26.575
6 Adjust (adjustable output)
GND (fixed output)
0.170 6.693 0.170 6.693
 
 

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($)
USM CS52015 100pc -WP $3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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