VERY LOW DROPOUT VOLTAGE REGULATORS USM L48XX-ADJ The USM L48XX-ADJ series devices are voltage regulator with a very low voltage drop ( typically 0.4 V at fullrated current), output current up to 400mA, low current and comprehensive on-chip protection. The-quiescentse devices are protected against load dump and field decay transients of 60V, polarity reversal and overheating. A foldback current limiter protects against load short circuits. Available in 5V, 8.5V 9.2V, 10V and 12V versions ( all 4%, TI = 25C ) the-quiescentse regulators are designed for automotive, industrial and consumer applications where low consumption is particularly important. Input/Output Typ. 0.4V 400mA Output Current Low Quiescent Current Reverse Polarity Protection Over Voltage Protection (60V) Foldback Current Limiting Thermall Shutdown In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS DC Input Voltage +35 V DC Input Reverse Voltage -18 V Transient Input Overvoltages LoadDump: 5ms =< Trise =<10ms, tf Fall Time Constant = 100ms, Rsource =< 0.5 FieldDecay: 5ms =< Tfall =< 10ms,Rsource =< 10 tr Rise Time Constant = 33ms Junction and Storage Temperature Range -55 to +150 C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTIC VI=14.4V;CO=100F;Tj=25C unless otherwise specified. PARAMETER SYMBOL TEST CONDITIONS MIN TYP LIMIT UNITS Output Voltage VO IO=5mA to 400mA 4.8 5.0 5.2 V Operating Input Voltage VI 26 V Line Regulation DVO/VO VI=13 to 26V; IO=5mA 1 10 mV/V Load Regulation DVO/VO IO= 5 to 400mA* 3 15 mV/V Dropout Voltage VI-VO IL = 150mA IL = 400mA* 0.2 0.4 0.4 0.7 V QuiescentCurrent Iq IL = 0mA IL = 150mA IL = 400mA * 0.8 25 65 2 45 90 mA Temperature Output Voltage Drift DVO/DT*VO 0.1 mV/C*V Supply Voltage Rejection SVR IO=350mA;f=320Hz; CO=100F;VI=VO+3V+2Vpp 60 dB Maximum Output Current IO 800 mA Output Short Circuit Current (fold back condition) ISC 350 500 mA ELECTRICAL CHARACTERISTIC VI=14.4V;CO=100F;Tj=-40to125C (note1) unless otherwise specified. PARAMETER SYMBOL TEST CONDITIONS MIN TYP LIMIT UNITS Output Voltage VO IO=5mA to 400mA 4.70 5.0 5.30 V Operating Input Voltage VI Note 2 26 V Line Regulation DVO/VO VI=13 to 26V; IO=5mA 2 15 mV/V Load Regulation DVO/VO IO=5 to 400mA* 5 25 mV/V Dropout Voltage VI-VO IL = 150mA IL = 400mA* 0.25 QuiescentCurrent Iq IL = 0mA IL = 150mA IL = 400mA * Mximum Output Current IO 870 mA Output Short Circuit Current (fold back condition) ISC 230 mA (NOTE 1) This limits are guaranteed by design, correlation and statistical control on production samples ove rthe indicated temperature and supply voltage ranges. (NOTE 2) For a DC voltage 26V < 35V the device is not operating.

 
 
US MICROWAVES
Advanced Microwave Components
  400mA LOW DROPOUT VOLTAGE REGULATORS
L48XX-ADJ
 
 

FEATURES
APPLICATIONS
LDO VOLTAGE REGULATOR
400mA output within 2% over temperature
Very low quiescent current
Low dropout voltage (420 mV Typ)
Extremely tight load and line regulation
Very low temperature coefficient
Current and thermal limiting
Unregulated DC input can withstand -20V reverse battery and +60V positive transients;
Direct replacement for SGS-THOMSON, but USM48XX Series has lower ground current, higher accuracy of output voltage and extremely tight load line regulation
4-pins version (fixed model) and 5-pins versions (adjust model) has shutdown input
In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The USM L48XX-ADJ series of fixed-voltage monolithic micropower voltage regulators is designed for a wide range of applications. This device excellent choise for use in battery-powered application. Furthermore, the quiescent current increases only slightly at dropout, which prolongs battery life. This series of fixed-voltage regulators features very low quiescent current (100mA Typ.) and very low drop output voltage (Typ. 60mV al light load and 420mV at 400mA). This includes a tight initial tolerance of 0.5% typ., extremely good load and line regulation of 0.05% typ., and very low output temperature coefficient.


IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER VALUE UNITS
Power Dissipation   Vdc
Lead Temperature (Soldering, 5 sec) 300 °C
Storage Temperature Range -65 to +150 °C
Operating Junction Temperature Range -55 to +150 °C
Input Supply Voltage -20 to +35 V
Continuous total dissipation at 25°C free-air temperature 12 W
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTIC
VI=14.4V;CO=100F;Tj=25°C unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Output Voltage -25°C =<TJ =<85°C
Full Operating temperature
1mA =< IL =< 400mA, TJ =< TJMAX
0.985|VO|
0.98|VO|
0.975|VO|
VO

VO
1.015|VO|
1.02|VO|
1.025|VO|
V
Input Supply Voltage       26  
Output Voltage Temperature Coefficient (Note 1)   50 150 ppm/°C
Line Regulation (Note 2) 13V =< Vin =< 26V (Note 3)   0.1 0.4 %
Load Regulation (Note 2) 1mA=<IL =< 400mA   0.1 0.3 %
Dropout Voltage (Note 4) IL = 150mA
IL = 400mA
  200
420
400
700
mV
Ground Current (Note 5) IL = 100mA
IL = 150mA
IL = 400mA
  100
12
30
200
20
50
µA
mA
Dropout Ground Current (Note 5) Vin = Vout - 0.5V, IL = 150mA   110 120 µA
Current Limit Vout = 0   350 500 mA
Thermal Regulation (Note 6)     0.05 0.2 %/W
Output Noise, 10Hz to 100KHz IL = 100mA CL = 2.2µF
CL = 3.3µF
CL = 33µF
  500
350
120
  µVRMS
Ripple Rejection Ratio IO = 350mA, f = 120Hz, CO = 100µF,
Vin = VO + 3V + 2Vpp
60
    dB
Adjust model
Reference Voltage
Over Temperature (Note 7)
1.21
1.185
1.235 1.26
1.285
V
Feedback Pin Bias Current
  20 40 nA
Reference Voltage Temperature Coefficient
(Note 1)
  50   ppm/°C
Feedback Pin Bias Current Temperature Coefficient
  0.1   nA/°C
Shutdown Input
Input Logic Voltage
Low (Regulator ON)
High (Regulator OFF)

2
1.3
0.7
V
Shutdown Pin Input Current
Vs = 2.4V
Vs = 26V
  30
450
50
600
µA
Regulator Output Current in Shutdown
(Note 8)
5.0V =< Vout < 15.0V
3.3V =< Vout < 5.0V
2.0V =< Vout < 3.3V
   
10
20
30
 
 
(NOTE 1) Output or reference voltage temperature coefficients defined as the worst case voltage change divided by the total temperature range.
(NOTE 2) Regulations is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specification for the thermal regulation.
(NOTE 3) Line regulation is tested at 150°C for IL = 5mA. For IL = 100mA and TJ = 125°C. line regulation is guaranteed by design to 0.2%. For USM4815 16 =< VIN =< 26V.
(NOTE 4) Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential.
(NOTE 5) Ground pin current is the regulator quiescent. The total current drawn from the sources is the sum of the ground pin current and output load current.
(NOTE 6) Thermal regulation is the change in output voltage at a time T after a change in power dissipation, excluding load or line regulation effects. Specifications are for a 200mA load pulse (3W pulse) for T = 10ms.
(NOTE 7) Vref =< Vout =< (Vin - 1V), 2.3V =< Vin =< 26V, 100m =< IL =< 400mA, TJ =< TJMAX.
(NOTE 8) Vshutdown >= 2V, Vin >= 26V, Vout = 0V.

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) [mm] Bonding pads Backside metal
Silicon 10±1 (101.18x61.81)
[2.570x1.570]
min 7x7 mils, 1µm thick, aluminium Backside of the die is coated with 0.5m GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING
These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1m Aluminium. The backside of the die is coated with 0.5m GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD # FUNCTION X(mils) X(mm) Y(mils) Y(mm)
1 INPUT 10.827 0.275 50.394 1.280
2 OUTPUT 10.827 0.275 3.543 0.090
3 FEEDBACK (adjust model) 42.520 1.080 3.543 0.090
4 GND 69.488 1.765 3.543 0.090
5 SHUTDOWN 90.354 2.295 3.543 0.090
 
 

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($)
USM L48XX-ADJ 100pc -WP $3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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