TheUSM LT1582 high performance positive voltage regulators designed for use in applications requiring low dropout performance at full rated current. Additionally, the USM LT1582 provides excellent regulation over variations due to changes in line, load and temperature. Outstanding features include low dropout performance at rated current, fast transient response, internal current limiting and thermal shutdown protection of the output device. Low dropout performance 1.4V max Fact transient response 2% Total output regulation over line, load and temperature Adjust pin current max.90 A over temperature Line regulation 0.02% Load regulation 0.3% Microprocessor supplies, post regulators for switching supplies, high current regulators, series power supplies

 
 
US MICROWAVES
Advanced Microwave Components
  10 A, POSITIVE VOLTAGE REGULATORS
LT1582
 
 

FEATURES
APPLICATIONS
LDO VOLTAGE REGULATOR
Low dropout performance 1.4V max
Fact transient response
±2% Total output regulation over line, load and temperature
Adjust pin current max.90 µA over temperature
Line regulation 0.02%
Load regulation 0.3%
Microprocessor supplies, post regulators for switching supplies, high current regulators, series power supplies

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
TheUSM LT1582 high performance positive voltage regulators designed for use in applications requiring low dropout performance at full rated current. Additionally, the USM LT1582 provides excellent regulation over variations due to changes in line, load and temperature. Outstanding features include low dropout performance at rated current, fast transient response, internal current limiting and thermal shutdown protection of the output device.


IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNITS
Input Voltage VIN 7 V
Operating Junction Temperature Range Tj 0 to 125 °C
Storage Temperature Range Tstg -65 to 150 °C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTIC
(Unless otherwise specified, VIN=2.75V Io=10mA to 10.0 A)
PARAMETER SYMBOL CONDITIONS TEST LIMITS UNITS
VIN Io Tj(Note4) MIN TYPE MAX
Reference Voltage (Note1)
VREF
5V
10mA
25°C
1.238
1.250
1.262
V
    Over Temp 1.225 1.275
Line Regulation (Note1)
REG(LINE)
10mA
25°C
0.015
0.2
%
Over Temp.   0.035
Load Regulation (Note1)
REG(LOAD)
5V
  25°C   0.1 0.3 %
Over Temp.
0.2
0.4
Dropout Voltage DVREF=1%
VD
    25°C   1.1 1.4
V
Over Temp.
1.2
Current Limit
IS
Over Temp.
10.0
12
A
Temperature Coefficient
Tc
0.005
%/°C
Adjust Pin Current
Iadj
    25°C   55   µA
Over Temp.
90
Adjust Pin Current Change
DIadj
0.2
5
Temperature Stability
Ts
5V
0.5A
0.5
%
Minimum Load Current
Io
5V
5
10
mA
RMS Output Noise(Note2)
VN
25°C
0.003
%V
Ripple Rejection Ratio(Note3)
RA
5V
10.0A
Over Temp.
60
70
dB
 
(NOTE 1) Low duty cycle pulse testing with Kelvin connections required.
(NOTE 2) Bandwidth of 10 Hz to 10kHz.
(NOTE 3) 120Hz input ripple Cadj=25µF
(NOTE 4) Over Temp.- over specified operating junction temperature range.

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) [mm] Bonding pads Backside metal
Silicon 10±1 (122.05x129.92)
[3.1x3.3]
min 11x14 mils, 1µm thick, aluminium Backside of the die is coated with 0.5m GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING
These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1m Aluminium. The backside of the die is coated with 0.5m GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD # FUNCTION X(mils) X(mm) Y(mils) Y(mm)
1 VIN  x x x x
2 VOUT x x x x
3 VADJ x x x x
 
 

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($)
USM LT1582 100pc -WP $3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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