The USM CS5205 series of positive adjustable and fixed regulators are designed to provide 5A with higher efficiency than currently available devices. All internal circuitry is designed to operate down to 700mV input to output differential and the dropout voltage is fully specified as a function of load current. Dropout voltage of the device is 100mV at light loads and rising to 700mV at maximum output current. A second low current input is required to achieve this dropout. The USM CS5205 can also be used as a single supply device (3 pin version). On-chip trimming adjusts the reference voltage to 1%. Ajustable or Fixed Output Output Current of 5A Low Dropout 700mV at 5A Output Current 0.04% Line Regulation 0.1% Load regulation 100% Trermal limit Burn-In Fast Transient Response Remote sense High Eficiency Linear Regulators Post Regulators for Swiching Supplies

 
 
US MICROWAVES
Advanced Microwave Components
  3A Low Dropout Positive Voltage Regulator
CS5205
 
 

FEATURES
APPLICATIONS
LDO VOLTAGE REGULATOR
Ajustable or Fixed Output
Output Current of 5A
Low Dropout 700mV at 5A Output Current
0.04% Line Regulation
0.1% Load regulation
100% Trermal limit Burn-In
Fast Transient Response
Remote sense
High Eficiency Linear Regulators
Post Regulators for Swiching Supplies
Adjustable power supply

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The USM5205 series of positive adjustable and fixed regulators are designed to provide 5A with higher efficiency than currently available devices. All internal circuitry is designed to operate down to 500mV input to output differential and the dropout voltage is fully specified as a function of load current. Dropout voltage of the device is 100mV at light loads and rising to 500mV at maximum output current. A second low current input is required to achieve this dropout. The USM5205 can also be used as a single supply device (3 pin version). On-chip trimming adjusts the reference voltage to 1%. Current limit is also trimmed, minimizing the stress on both the regulator and power source circuitry under overload conditions.
The USM5205 series are ideal to power the next generation of advanced microprocessor on motherboards where both 5V and 3.3V supplies are available


IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNITS
Power Dissipation PD Internally limited W
Input Voltage
Vpower
Vcontrol
VIN
7
13
V
Operating Junction Temperature Range
Control Section
Power Transistor
TJ
0 to 125
0 to150
°C
Storage Temperature Range TSTG -65 to +150 °C
Lead Temperature (Soldering, 10 sec.) TLEAD 300 °C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTIC
(Note1) ILOAD=0mA and TJ=+250C unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Reference Voltage VCONTROL=2.75V; VPOWER=2V; ILOAD=10mA
VCONTROL=2.7V to 12V; VPOWER=3.3V to 5.5V
ILOAD=10mA to 5A
 1.238
1.230
 1.250
1.250
1.262
1.270
 
 V
Output Voltage
USM CS5205-1.5
VCONTROL=4V; VPOWER=2V
VCONTROL=3V; VPOWER=2.3V
ILOAD=0mA to 5A
 1.485
1.475
1.500
1.500
 
 1.515
1.525
 V 
Output Voltage
USM CS5205-2.5
VCONTROL=.5V; VPOWER=3.3V
VCONTROL=4V; VPOWER=3.3V
ILOAD=0mA to 5A
2.475
2.460
 
2.500
2.500
 
2.525
2.540
 
 V 
Output Voltage
USM CS5205-2.85
VCONTROL=5.35V; VPOWER=3.35V
VCONTROL=4.4V; VPOWER=3.7V
ILOAD=0mA to 5A
 2.821
2.805
 2.850
2.850
2.879
2.895
 
 V 
Output Voltage
USM CS5205-3.0
VCONTROL=5.5V; VPOWER=3.5V
VCONTROL=4.5V; VPOWER=3.8V
ILOAD=0mA to 5A
2.970
2.950
 
3.000
3.000
 
3.030
3.050
 
 V 
Output Voltage
USM CS5205-3.3
VCONTROL=5.8V; VPOWER=3.8V
VCONTROL=4.8V; VPOWER=4.1V
ILOAD=0mA to 5A
 3.267
3.247
3.300
3.300
 
 3.333
3.535
 V  
Output Voltage
USM CS5205-3.5
VCONTROL=6V; VPOWER=4V
VCONTROL=5V; VPOWER=4.3V
ILOAD=0mA to 5A
 3.465
3.445
 3.500
3.500
 3.535
3.555
  V 
Output Voltage
USM CS5205-5.0
VCONTROL=7.5V; VPOWER=5.5V
VCONTROL=6.5V; VPOWER=5.8V
ILOAD=0mA to 5A
 4.950
4.920
 5.000
5.000
5.050
5.080
 
 V  
Line Regulation ILOAD=10mA; (1.5V+VOUT)=<VCONTROL=<12V
0.8=<(VPOWER-VOUT)=<5.5V
   0.04
0.2 
 %
Line Regulation VCONTROL=VOUT+2.5V; VPOWER=VOUT+0.8V
ILOAD=10mA to 5A
  0.08
 
 0.4
 %
Minimum Load Current
(Note2)
VCONTROL=5V; VPOWER=3.3V; VADJ=0V    1.7
 5
 mA
Control Pin Current
(Note3)
VCONTROL=VOUT+1.5V; VPOWER=VOUT+0.8V
ILOAD=10mA to 5A
    20
 
 mA
Ground Pin Current
VCONTROL=VOUT+2.5V; VPOWER=VOUT+0.8V
ILOAD=0mA to 5A
   5
10
 
 mA
Adjust Pin Current
VCONTROL=2.75V; VPOWER=2.05V;
ILOAD=10mA
   50
120
 
 µA
Current Limit
VIN-VOUT=3V
 1000 1500     A
Ripple Rejection
VCONTROL=VPOWER=VOUT+2.5V; VRIPPLE=1V
ILOAD=500mA
 60
75
 
   dB
Thermal Regulation
TA=25°C, 30 ms pulse
  0.003    %/W 
Dropout Voltage
(Note 4)
       
Control Input
(VCONTROL-VOUT)
VPOWER=VOUT+0.8V; ILOAD=10mA
ILOAD=5A
   1.00
1.15
1.15
1.30 
 V
Power Input
VPOWER-VOUT
VCONTROL=VOUT+2.5V; ILOAD=10mA
VCONTROL=VOUT+2.5V; ILOAD=5A
  0.10
0.55
0.17
0.70
 
(NOTE 1) VOUT=VSENSE; VADJ=0 unless otherwise specified
(NOTE 2) For the adjustable device the minimum load current is the minimum current required to mantain regulation. Normally the current in the resistor devider used to set the output voltage is selected to meet the minimum load current requirement.
(NOTE 3) The control pin current is the driver current required for the output transistor. This current will track output
current whit a ratio of about 1:100
(NOTE 4) The dropout voltage for the CS5205 is caused by either minimum control voltage or minimum power voltage. The specification represent the minimum input/output voltage required to mantain 1% regulation.

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) [mm] Bonding pads Backside metal
Silicon 10±1 (122.05x71.65±1)
[3.1x1.82]
min 7x7 mils, 1µm thick, aluminium Backside of the die is coated with 0.5Ám GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING
These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1Ám Aluminium. The backside of the die is coated with 0.5Ám GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD # FUNCTION X(mm) Y(mm)
1 OUT 0.205 1.625
2 OUT 1.55 1.620
3 OUT 2.875 1.625
4 VPower 0.875 1.200
5 VPower 2.225 1.200
6 VControl 1.55 0.890
7 Sense 0.205 0.665
8 Adjust (adjustable output)
GND (fixed output)
0.205 0.205
 
 

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($)
USM CS5205 100pc -WP $3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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