LM324 equivalent die to USMLM324 Low Power Quad Operational Amplifiers for hybrid circuits known good die LM series from US Microwaves

Low Power Quad Operational Amplifiers USM LM324 FEATURES APPLICATIONS Low Power Quad Operational Amplifiers Internally frequency compensated forunity gain Large DC voltage gain 100dB Wide bandwidth (unitygain)1MHz Very low supply current drain (700µA) - essentially independent of supply voltage Low input biasing current 45 nA Low input offset voltage 2mV and offset current 5nA In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The USM LM324 series are low–cost, quad operational amplifiers with true differential inputs. They have several distinct advantages over standard operational amplifier types in single supply applications. The quad amplifier can operate at supply voltages as low as 3.0 V or as high as 32 V with quiescent currents about one–fifth of those associated with the MC1741 (on a per amplifier basis). The common mode input range includes the negative supply, thereby eliminating the necessity for external biasing components in many applications. The output voltage range also includes the negative power supply voltage. IC SCHEMATIC DIAGRAM MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Supply Voltage Vdc Single Supply VCC 32 V Split Supplies VCC,VEE ±16 V Input Differential Voltage Range (Note 1) VDIR ±32 V Input Common Mode Voltage Range VICR -0.3 to 32 V Output Short Circuit Duration tSC Continuous Junction Temperature TJ 150 °C Storage Temperature Range Tstg -55 to +125 °C Operating Ambient Temperature Range TA 0 to +70 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. ELECTRICAL CHARACTERISTICS PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Input Offset Voltage VCC=5.0V to 30V VICR=0V to VCC=1.7V VO=1.4V, RS=0W TA=250°C TA=Thigh(Note 1) TA=Tlow(Note 1) VIO - - - 2.0 - - 7.0 9.0 9.0 mV Average Temperature Coefficient of Input Offset Voltage TA=Thigh to Tlow(Note 1) DVIO/DT - 7.0 - µV/°C Input Offset Current Input Bias Current TA=Thigh to Tlow (Note 1) TA=Thigh to Tlow (Note 1) IIO - - - - 5.0 - -90 - 50 150 -250 -500 nA Average Temperature Coefficient of Input Offset Voltage TA=Thigh to Tlow (Note 1) - 10 - pA/°C Input Common Mode Voltage Range (Note 2) VCC=30V V=30V TA=Thigh to Tlow (Note 1) VICR 0 0 - - 28.3 28 V Differential Input Voltage Range VIDR - - VCC V Large Signal Open Loop Voltage Gain RL=2.0kW, VCC=15V, for Large VOSwing, TA=Thigh to Tlow (Note 1) AVOL 25 15 100 - - - V/mV Channel Separation 1.0kHz=< f=<20kHz Input Referenced CS - -120 - dB Common Mode Rejection RS=< 10kW CMR 65 70 - dB Power Supply Rejection PSR 65 100 - dB Output Voltage-High Limit (TA=Thigh to Tlow) (Note 1) VCC=5.0V, RL=2.0kW, TA=25°C VCC=30V, RL=2.0kW VCC=30V, RL=10kW VOH 3.3 26 27 3.5 - 28 - - - V Output Voltage-Low Limit VCC=5.0V, RL=10kW (TA=Thigh to Tlow) (Note 1) VOL - 5.0 20 mV Output Source Current VID=+1.0V, VCC=15V TA=25°C TA=Thigh to Tlow IO+ 20 10 40 20 - - mA Output Sink Current VID=-1.0V, VCC=15V TA=25°C TA=Thigh to Tlow VID=-1.0V, VCC=200mV IO- 10 5.0 12 20 8.0 50 - - mA µA Output Short Circuit to Ground (Note 3) ISC - 40 60 mA Power Supply Current TA=Thigh to Tlow (Note 1) VCC=30V, VO=0V, RL=¥ VCC=5.0V, VO=0V, RL=¥ ICC - - - - 3.0 1.2 mA Note1 Tlow=0°C for LM324, Thigh=+70°C for LM324 Note2 The input common mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end of the common mode voltage range is VCC -1.7V. pan> GENERAL DIE INFORMATION Substrate Thickness (mils) Die size (mils) [mm] Bonding pads(mils) Backside metal Silicon 10±1 (62.992x59.843)[1.6x1.52] 3.543X3.543 Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1µm Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) Y(mm) 1 #1 OUT 34.960 0.888 3.464 0.088 2 #1 IN- 56.102 1.425 7.283 0.185 3 #1 IN+ 56.102 1.425 20.511 0.521 4 VCC 56.102 1.425 28.031 0.712 5 #2 IN+ 56.102 1.425 35.787 0.909 6 #2 IN- 56.102 1.425 49.015 1.245 7 #2 OUT 34.960 0.888 52.834 1.342 8 #3 OUT 28.488 0.622 1.342 52.834 9 #3 IN- 3.346 0.085 1.245 49.015 10 #3 IN+ 3.346 0.085 0.909 35.787 11 GND 3.720 0.094 0.712 28.031 12 #4 IN+ 3.346 0.085 0.521 20.511 13 #4 IN- 3.346 0.085 0.185 7.283 14 #4 OUT 24.488 0.622 0.088 3.464 STANDARD PRODUCTS ORDERING INFORMATION STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USMLM324 100pc -WP $3.20 List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice. Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.



US MICROWAVES Advanced Microwave Components		Low Power Quad Operational Amplifiers USM LM324

FEATURES

APPLICATIONS

Low Power Quad Operational Amplifiers

Internally frequency compensated forunity gain

Large DC voltage gain 100dB

Wide bandwidth (unitygain)1MHz

Very low supply current drain (700µA) - essentially independent of supply voltage

Low input biasing current 45 nA

Low input offset voltage 2mV and offset current 5nA

In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

The USM LM324 series are low–cost, quad operational amplifiers with true differential inputs. They have several distinct advantages over standard operational amplifier types in single supply applications. The quad amplifier can operate at supply voltages as low as 3.0 V or as high as 32 V with quiescent currents about one–fifth of those associated with the MC1741 (on a per amplifier basis). The common mode input range includes the negative supply, thereby eliminating the necessity for external biasing components in many applications. The output voltage range also includes the negative power supply voltage.

IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER	SYMBOL	VALUE	UNITS
Power Supply Voltage			Vdc
Single Supply	V_CC	32	V
Split Supplies	V_CC,V_EE	±16	V
Input Differential Voltage Range (Note 1)	V_DIR	±32	V
Input Common Mode Voltage Range	V_ICR	-0.3 to 32	V
Output Short Circuit Duration	t_SC	Continuous
Junction Temperature	T_J	150	°C
Storage Temperature Range	Tstg	-55 to +125	°C
Operating Ambient Temperature Range	T_A	0 to +70	°C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTICS
PARAMETER	TEST CONDITIONS	SYMBOL	MIN	TYP	MAX	UNITS
Input Offset Voltage	V_CC=5.0V to 30V V_ICR=0V to V_CC=1.7V V_O=1.4V, R_S=0W T_A=250°C T_A=Thigh(Note 1) T_A=Tlow(Note 1)	V_IO	- - -	2.0 - -	7.0 9.0 9.0	mV
Average Temperature Coefficient of Input Offset Voltage	T_A=Thigh to Tlow(Note 1)	DV_IO/DT	-	7.0	-	µV/°C
Input Offset Current Input Bias Current	T_A=Thigh to Tlow (Note 1) T_A=Thigh to Tlow (Note 1)	I_IO	- - - -	5.0 - -90 -	50 150 -250 -500	nA
Average Temperature Coefficient of Input Offset Voltage	T_A=Thigh to Tlow (Note 1)		-	10	-	pA/°C
Input Common Mode Voltage Range (Note 2)	V_CC=30V V=30V T_A=Thigh to Tlow (Note 1)	V_ICR	0 0	- -	28.3 28	V
Differential Input Voltage Range		V_IDR	-	-	V_CC	V
Large Signal Open Loop Voltage Gain	R_L=2.0kW, V_CC=15V, for Large VOSwing, T_A=Thigh to Tlow (Note 1)	A_VOL	25 15	100 -	- -	V/mV
Channel Separation	1.0kHz=< f=<20kHz Input Referenced	C_S	-	-120	-	dB
Common Mode Rejection	R_S=< 10kW	C_MR	65	70	-	dB
Power Supply Rejection		P_SR	65	100	-	dB
Output Voltage-High Limit	(T_A=Thigh to Tlow) (Note 1) V_CC=5.0V, R_L=2.0kW, T_A=25°C V_CC=30V, R_L=2.0kW V_CC=30V, R_L=10kW	V_OH	3.3 26 27	3.5 - 28	- - -	V
Output Voltage-Low Limit	V_CC=5.0V, R_L=10kW (T_A=Thigh to Tlow) (Note 1)	V_OL	-	5.0	20	mV
Output Source Current	V_ID=+1.0V, V_CC=15V T_A=25°C T_A=Thigh to Tlow	I_O+	20 10	40 20	- -	mA
Output Sink Current	V_ID=-1.0V, V_CC=15V T_A=25°C T_A=Thigh to Tlow V_ID=-1.0V, V_CC=200mV	I_O-	10 5.0 12	20 8.0 50	- -	mA µA
Output Short Circuit to Ground (Note 3)		I_SC	-	40	60	mA
Power Supply Current	T_A=Thigh to Tlow (Note 1) V_CC=30V, V_O=0V, R_L=¥ V_CC=5.0V, V_O=0V, R_L=¥	I_CC	- -	- -	3.0 1.2	mA

Note1 Tlow=0°C for LM324, Thigh=+70°C for LM324
Note2 The input common mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V. The upper end of the common mode voltage range is VCC -1.7V. pan>

GENERAL DIE INFORMATION
Substrate	Thickness (mils)	Die size (mils) [mm]	Bonding pads(mils)	Backside metal
Silicon	10±1	(62.992x59.843)[1.6x1.52]	3.543X3.543	Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING

These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1µm Aluminium. The backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #	FUNCTION	X(mils)	X(mm)	Y(mils)	Y(mm)
1	#1 OUT	34.960	0.888	3.464	0.088
2	#1 IN-	56.102	1.425	7.283	0.185
3	#1 IN+	56.102	1.425	20.511	0.521
4	V_CC	56.102	1.425	28.031	0.712
5	#2 IN+	56.102	1.425	35.787	0.909
6	#2 IN-	56.102	1.425	49.015	1.245
7	#2 OUT	34.960	0.888	52.834	1.342
8	#3 OUT	28.488	0.622	1.342	52.834
9	#3 IN-	3.346	0.085	1.245	49.015
10	#3 IN+	3.346	0.085	0.909	35.787
11	GND	3.720	0.094	0.712	28.031
12	#4 IN+	3.346	0.085	0.521	20.511
13	#4 IN-	3.346	0.085	0.185	7.283
14	#4 OUT	24.488	0.622	0.088	3.464

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART #	MINIMUM ORDER QUANTITY	Waffle Packs	U/P($)
USMLM324	100pc	-WP	$3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

Last updated: July 01, 2009
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