GHz MICROWAVE CERAMIC THIN FILM CHIP RESISTORS USM RGxxyyTnn
FEATURES APPLICATIONS CHIP RESISTOR
High power dissipation while working up to GHz range frequencies Low insertion loss
High reliability and ruggedness Small chip size with reduced stray capacitance per unit area.
Low temperature coefficient and wide operating temperature range. Lab Kit available
Microwave and RF terminations Resistive microwave dividers Wilkinson power dividers Attenuators Microwave amplifiers
PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The USM RG1020T20 series of 20GHz microwave thin film chip resistors is designed to be used in microwave hybrid circuits for biasing of active components and as feedback resistors for high speed transimpedance amplifiers for optical communication receivers. To attain very low capacitance to ground, these chip resistors are manufactured on 20 mils Al2O3 ceramic substrates and do not have backside metallization.
These devices are specifically designed and manufactured to be compatible with gold wire bonding. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000W/sq.
TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
PARAMETER VALUE UNITS
Resistance range 1 to 1E6 W
Maxim Power 5 mW
Maxim Capacitance 0.016 pF
RC constant (defined for 1000 W resistance) 16 ps
3dB frequency (defined for selected 50 W resistance) 196.49 GHz
Temperature Coefficient -55°C to 150°C 75 ppm/°C
Tolerances available 1%
Operating Temperature range -65 to 200 °C
Working voltage (Vw) 23 V
Peak voltage at 25C, 5 sec 33 V
Insulation resistance at 25 C 5.1E+12 W
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.
GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal Ceramic
Al2O3 nn ±1 ww x ll ±2 min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Backside of the die is NOT metallized for RG series. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
DIE LAYOUT - MECHANICAL SPECIFICATIONS
STANDARD PRODUCTS ORDERING INFORMATION: RGxxyyTnn-value-q%
R [ohm] R multiplier TOLERANCE max VOLTAGE [V] max F @3dB [GHz]
STANDARD PRODUCTS PRICE LIST
USM PART # MINIM ORDER QUANTITY Waffle Packs U/P($)
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.
US Microwaves P/N Quantity E-mail
ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.
U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.