GHz Microwave ceramic thin film chip resistors, Aluminum Oxide chip resistors, 20.68 GHz 3dB frequency at 50ohms 20 x 20 mils, 10 mils thick USM RG2040T10 microwave chip resistors manufactured by US Microwaves GHz Ceramic thin film resistors for microwave and transimpedance amplifiers for optical communication receivers RG2040T10 GHz Microwave ceramic thin film chip resistors, Aluminum Oxide chip resistors, 20.68 GHz 3dB frequency at 50ohms 20 x 20 mils, 10 mils thick USM RG2040T10 microwave chip resistors manufactured by US Microwaves GHz Microwave ceramic thin film chip resistors, Aluminum Oxide chip resistors, 20.68 GHz 3dB frequency at 50ohms 20 x 20 mils, 10 mils thick USM RG2040T10 microwave chip resistors manufactured by US Microwaves GHz Ceramic thin film resistors for microwave and transimpedance amplifiers for optical communication receivers RG2040T10 US MICROWAVESAdvanced Microwave Components 44mW GHz MICROWAVE CERAMIC THIN FILM CHIP RESISTORSUSM RG2040T10 44mW FEATURES APPLICATIONS CHIP RESISTOR High power dissipation while working up to GHz range frequencies Low insertion loss High reliability and ruggedness Small chip size with reduced stray capacitance per unit area. Low temperature coefficient and wide operating temperature range. Lab Kit available Microwave and RF terminations Resistive microwave dividers Wilkinson power dividers Attenuators Microwave amplifiers PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE The USM RG2040T10 series of 20GHz microwave thin film chip resistors is designed to be used in microwave hybrid circuits for biasing of active components and as feedback resistors for high speed transimpedance amplifiers for optical communication receivers. To attain very low capacitance to ground, these chip resistors are manufactured on 10 mils Al2O3 ceramic substrates and do not have backside metallization. These devices are specifically designed and manufactured to be compatible with gold wire bonding. These devices can be used over the full military temperature range -55C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1ohm/sq to 10,000W/sq. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL CHARACTERISTICS PARAMETERVALUEUNITS Resistance range 1 to 1E6 W Maxim Power 44 mW Maxim Capacitance 0.154 pF RC constant (defined for 1000 W resistance)154 ps 3dB frequency (defined for selected 50 W resistance)20.68 GHz Temperature Coefficient -55C to 150C75 ppm/deg C Tolerances available 1, 5 % Operating Temperature range-65 to 200 C Working voltage (Vw) 66V Peak voltage at 25C, 5 sec93 V Insulation resistance at 25 C2.5E+12W ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION SubstrateThickness (mils)Die size (mils)Bonding padsBackside metal CeramicAl2O3 10 1 20 x 40 2min 4x4 mils, 3m thick, 99.99% electroplated gold with a TiW barrierBackside of the die is NOT metallized for RG series. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). DIE LAYOUT - MECHANICAL SPECIFICATIONS STANDARD PRODUCTS ORDERING INFORMATION: RG2040T10-value-q% R [W]R multiplierTOLERANCEmax VOLTAGE [V]max F @3dB [GHz] R multiplier -10%-5%-1% Find part # STANDARD PRODUCTS PRICE LIST USM PART #MINIM ORDER QUANTITYWaffle PacksU/P($) USM RG2040T10-xxx-1% -WP USM RG2040T10-xxx-5% -WP Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/NQuantityE-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. HomeProduct TreeTech. SupportPrint PDFRequest QuoteInventoryPlace OrderContact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES
Advanced Microwave Components
  CUSTOM GHz mW MICROWAVE CERAMIC THIN FILM CHIP RESISTOR
GHz mW USM RGWWLLTTT
 
 

FEATURES
APPLICATIONS
CHIP RESISTOR
High power dissipation while working up to GHz range frequencies
Low insertion loss
High reliability and ruggedness
Small chip size with reduced stray capacitance per unit area.
Low temperature coefficient and wide operating temperature range.
Low temperature coefficient and wide operating temperature range.
Microwave and RF terminations
Resistive microwave dividers
Wilkinson power dividers
Microwave and RF terminations
Attenuators
Microwave amplifiers
20GHz microwave ceramic thin film chip resistor RGxxyyTnn

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The USM RGWWLLTTT series of 20GHz microwave thin film chip resistors is designed to be used in microwave hybrid circuits for biasing of active components and as feedback resistors for high speed transimpedance amplifiers for optical communication receivers. To attain very low capacitance to ground, these chip resistors are manufactured on 5 mils Al2O3 ceramic substrates and do not have backside metallization. These devices are specifically designed and manufactured to be compatible with gold wire bonding. These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1W/sq to 10,000W/sq.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.


ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Resistance range 1 to 1E6 W
Maxim Power 272 mW
Maxim Capacitance 1.037 pF
3dB frequency (defined for selected 50 W resistance) 3 GHz
Temperature Coefficient -55°C to 150°C 75 ppm/deg C
Tolerances available 1 %
Operating Temperature range -65 to 200 °C
Working voltage (Vw) 165 V
Peak voltage at 25C, 5 sec 223 V
Insulation resistance at 25 C 1.3E12 W

ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.


GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Bonding pads Backside metal
Ceramic
Al2O3
TT ±1 WW x LL ±2 min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier Backside of the die is NOT metallized for RG series.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).

DIE LAYOUT - MECHANICAL SPECIFICATIONS
20GHz microwave ceramic thin film chip resistor RGxxyyTnn

STANDARD PRODUCTS ORDERING INFORMATION

L [mils] W [mils] Thickness [mils]
R [W] R multiplier TOLERANCE
Find part #
Note1: The first 3 digits are significant figures and the last digit specifies the number of zeros to follow (10 exponent), i.e. (nnn)x10M. If less than 4 digits, it means the absolute value, and it might include decimal point.
Note2: For different values than listed on P/N Builder above (standard EIA E192), please use the RFQ link located on the bottom of this page.

STANDARD PRODUCTS PRICE LIST
USM PART # MINIM ORDER QUANTITY Waffle Packs U/P($)
USM RGWWLLTTT-XXX-1%   -WP  
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 06, 2009
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