USMRPLLLWWWTTAN r ohm, p W, GHz ALUMINIUM NITRIDE POWER CHIP RESISTORS Microwave power resistors on Aluminium Nitride AlN pW 3dB LLxWW mils manufactured by US Microwaves Aluminium Nitride,AlN,thin film resistors,microwave,power chip resistors,power resistors,power terminations, power dividers, power attenuators,microwave power resistors,microwave power terminations,microwave power dividers,microwave power attenuators,microwave power chip resistors,microwave power chip terminations,microwave power chip dividers,microwave power chip attenuators USMRPLLLWWWTTAN r ohm, p W, GHz ALUMINIUM NITRIDE POWER CHIP RESISTORS Microwave power resistors on Aluminium Nitride AlN pW 3dB LLxWW mils manufactured by US Microwaves Aluminium Nitride,AlN,thin film resistors,microwave,power chip resistors,power resistors,power terminations, power dividers, power attenuators,microwave power resistors,microwave power terminations,microwave power dividers,microwave power attenuators,microwave power chip resistors,microwave power chip terminations,microwave power chip dividers,microwave power chip attenuators US MICROWAVES CUSTOM DESIGNS xΩ, pW, fGHz ALUMINIUM NITRIDE POWER CHIP RESISTORS Advanced Microwave Components USMRPLLLWWWTTAN FEATURES APPLICATIONS AlN POWER CHIP RESISTOR High power dissipation while working up to GHz range frequencies Low insertion loss High reliability and ruggedness Small chip size with reduced stray capacitance per unit area Low temperature coefficient Wide operating temperature range Microwave and RF high power terminations Resistive microwave power dividers Wilkinson power dividers Power attenuators Microwave power amplifiers r ohm, p W, GHz ALUMINIUM NITRIDE POWER CHIP RESISTORS USMRPLLLWWWTTAN PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USMRPLLLWWWTTAN, rΩ, pW, fGHz, Aluminium Nitride (AlN) flange less power chip resistors are designed to be used in chip and wire hybrid circuits as microwave and RF power resistors, power terminations, Wilkinson power dividers, power attenuators, microwave power amplifiers, etc. Flange less thin film power chip resistors and terminations have low temperature coefficients, low noise and increased long term stability compared to their thick film counterpart (see app note 110). In high power applications, temperature coefficient of resistance and long term stability have to be the best available. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Resistance R Ω Maxim Power P W Maxim Capacitance C pF 3dB frequency F GHz Temperature Coefficient -55C to 150C 100 ppm/°C Tolerance 1 % Operating Temperature range -65 to +200 °C Working voltage (Vw) √(P*R) V Peak voltage at 25C, 5 sec 1.5Vw V Insulation resistance at 25 C 1013 Ω ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal Aluminium Nitride (AlN) 30±3 LLxWW±2 min 4x4 mils, 3um thick, 99.99% electroplated gold with a TiW barrier Backside of the die is metallized with standard Ti/Pt/Au compatible with Au-Sn, Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). AlN POWER CHIP RESISTOR DIE LAYOUT / MECHANICAL SPECIFICATIONS r ohm, p W, GHz ALUMINIUM NITRIDE POWER CHIP RESISTORS USMRPLLLWWWTTAN AlN POWER CHIP RESISTOR CHIP MOUNT <span id=xΩ, pW, fGHz ALUMINIUM NITRIDE POWER CHIP RESISTORS USMRPLLLWWWTTAN power chip resistor mount" /> AlN POWER CHIP RESISTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Flangeless power chip resistors are designed for critical designs where space is at premium. The flangeless power chip resistors can be die attached to the heat sink or to a base plate using AuSn or AuGe preforms. Since the power chip resistors do not have terminals, they have to be attached using gold ribbon via gap welding after the backside is soldered in place. Backside metallization for power chip resistors is Ti/Pt/Au which is also compatible with Sn solder. For the more common SnPb, a Ti/Ni/Au backside metallization should be requested. POWER CHIP RESISTORS S PARAMETERS NOT AVAILABLE ONLINE FOR CUSTOM DESIGN, PLEASE CONTACT TECHNICAL SUPPORT STANDARD PRODUCTS ORDERING INFORMATION USM P/N WAFFLE PACK R [Ω] MIN. QTY U/P [$] USMRPLLLWWWTTAN -WP 50 - - QUICK CUSTOM RESISTOR BUILDER L, W, T, R and Rmultiplier required L [mils] W [mils] T [mils] R [Ω] R multiplier TOLERANCE max VOLTAGE [V] max F @3dB [GHz] V F Find part # Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales Last updated: US MICROWAVES www.usmicrowaves.com Tel:(408)986-8026 Fax:(408)986-8027 1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES   CUSTOM DESIGNS
xΩ, pW, fGHz ALUMINIUM NITRIDE POWER CHIP RESISTORS
Advanced Microwave Components   USMRPLLLWWWTTAN
 
 

FEATURES
APPLICATIONS
AlN POWER CHIP RESISTOR
High power dissipation while working up to GHz range frequencies
Low insertion loss
High reliability and ruggedness
Small chip size with reduced stray capacitance per unit area
Low temperature coefficient
Wide operating temperature range
Microwave and RF high power terminations
Resistive microwave power dividers
Wilkinson power dividers
Power attenuators
Microwave power amplifiers
r ohm, p W, GHz ALUMINIUM NITRIDE POWER CHIP RESISTORS USMRPLLLWWWTTAN

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
USMRPLLLWWWTTAN, rΩ, pW, fGHz, Aluminium Nitride (AlN) flange less power chip resistors are designed to be used in chip and wire hybrid circuits as microwave and RF power resistors, power terminations, Wilkinson power dividers, power attenuators, microwave power amplifiers, etc. Flange less thin film power chip resistors and terminations have low temperature coefficients, low noise and increased long term stability compared to their thick film counterpart (see app note 110). In high power applications, temperature coefficient of resistance and long term stability have to be the best available.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

ELECTRICAL/MECHANICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Resistance R Ω
Maxim Power P W
Maxim Capacitance C pF
3dB frequency F GHz
Temperature Coefficient -55C to 150C 100 ppm/°C
Tolerance 1 %
Operating Temperature range -65 to +200 °C
Working voltage (Vw) √(P*R) V
Peak voltage at 25C, 5 sec 1.5Vw V
Insulation resistance at 25 C 1013 Ω
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION
Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal
Aluminium Nitride
(AlN)
30±3 LLxWW±2 min 4x4 mils, 3um thick, 99.99% electroplated gold with a TiW barrier Backside of the die is metallized with standard Ti/Pt/Au compatible with Au-Sn, Au-Ge or silver filled conductive epoxy. Custom metallization is available for special orders.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).

AlN POWER CHIP RESISTOR DIE LAYOUT / MECHANICAL SPECIFICATIONS
r ohm, p W, GHz ALUMINIUM NITRIDE POWER CHIP RESISTORS USMRPLLLWWWTTAN
AlN POWER CHIP RESISTOR CHIP MOUNT
r Ω, p W, f GHz ALUMINIUM NITRIDE POWER CHIP RESISTORS USMRPLLLWWWTTAN power chip resistor mount
AlN POWER CHIP RESISTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Flangeless power chip resistors are designed for critical designs where space is at premium. The flangeless power chip resistors can be die attached to the heat sink or to a base plate using AuSn or AuGe preforms. Since the power chip resistors do not have terminals, they have to be attached using gold ribbon via gap welding after the backside is soldered in place. Backside metallization for power chip resistors is Ti/Pt/Au which is also compatible with Sn solder. For the more common SnPb, a Ti/Ni/Au backside metallization should be requested.

POWER CHIP RESISTORS S PARAMETERS
NOT AVAILABLE ONLINE FOR CUSTOM DESIGN, PLEASE CONTACT TECHNICAL SUPPORT

STANDARD PRODUCTS ORDERING INFORMATION
USM P/N WAFFLE PACK R [Ω] MIN. QTY U/P [$]
USMRPLLLWWWTTAN -WP 50 - -

QUICK CUSTOM RESISTOR BUILDER
L, W, T, R and Rmultiplier required
L [mils] W [mils] T [mils]

R [Ω] R multiplier TOLERANCE max VOLTAGE [V] max F @3dB [GHz]
V F
Find part #


List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.


Last updated: October 08, 2010
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