Microwave thin film chip resistors RQ3000T25 Low capacitance quartz substrate thin film feedback resistors for microwave and transimpedance amplifiers applications manufactured by US Microwaves Quartz thin film resistors for microwave and transimpedance amplifiers for optical communication receivers RQ3000T25 Microwave thin film chip resistors RQ3000T25 Low capacitance quartz substrate thin film feedback resistors for microwave and transimpedance amplifiers applications manufactured by US Microwaves Microwave thin film chip resistors RQ3000T25 Low capacitance quartz substrate thin film feedback resistors for microwave and transimpedance amplifiers applications manufactured by US Microwaves Quartz thin film resistors for microwave and transimpedance amplifiers for optical communication receivers RQ3000T25 US MICROWAVESAdvanced Microwave Components 0.82mW 115.68GHz QUARTZ MICROWAVE THIN FILM RESISTORS USM RQ3000T25-115.68GHz-0.82mW FEATURES APPLICATIONS QUARTZ RESISTOR Wide resistance range 0.1W to 91KW Good TCR tracking Very low capacitance value Available in die form and shipped in waffle packs Biasing discrete transistors circuits Feedback resistors for amplifiers Chip & wire hybrid circuits Surface mount circuits Transimpedance amplifiers Optical communication receivers SHORT PRODUCT APPLICATION NOTE The RQ3000T25 quartz series of microwave thin film chip resistors is designed to be used in microwave hybrid circuits for biasing of active components and as feedback resistors for high speed transimpedance amplifiers. To attain very low capacitance to ground, these chip resistors are manufactured on quartz substrates and do not have backside metallization. These devices can be used over the full military temperature range -55C to +125C. Quality and workmanship is per MIL-STD-883. Devices are 100% tested, visual inspected and packaged in waffle packs. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq. Custom lab kits are available: RQ3000T25 Lab kit TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. ELECTRICAL CHARACTERISTICS PARAMETERVALUEUNITS Resistance range 1 to 1E6 W Maxim Power 0.82 mW Maxim Capacitance 0.028 pF RC constant (defined for 50 W resistance)1.38 ps 3dB frequency (defined for selected 50 W resistance)115.68 GHz Temperature Coefficient -55C to 150C75 ppm/deg C Tolerances available 1, 5 % Operating Temperature range-65 to 200 C Working voltage (Vw) 6.4V Peak voltage at 25C, 5 sec9.1 V Insulation resistance at 25 C6.E+12W ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION SubstrateThickness (mils)Die size (mils)ResistorBonding padsBackside metal SiO2 - Quartz 25130 x 30 2The resistive material is high stability Tantalum Nitride with low temperature coefficient of resistance, <75ppm/C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary.The bonding pads of the resistors are min 4x4 mils, 3m thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400C in air without loss of adhesion.The backside of the die is NOT metallized. Standard TiW/Au or other custom metallizations are available upon special request. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MTR chip resistors (5% and 10% tolerance only) are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). DIE LAYOUT - MECHANICAL SPECIFICATIONS STANDARD PRODUCTS ORDERING INFORMATION R [W]R multiplierTOLERANCEmax VOLTAGE [V]max F @3dB [GHz] Note1: The first 3 digits are significant figures and the last digit specifies the number of zeros to follow (10 exponent), i.e. (nnn)x10M. If less than 4 digits, it means the absolute value, and it might include decimal point. Note2: For different values than listed on P/N Builder above (standard EIA E192), please use the RFQ link located on the bottom of this page. USM PART #QUANTITYToleranceWAFLE PACKS U/P($)ToleranceWAFLE PACKS U/P($)ToleranceWAFLE PACKS U/P($) USM RQ3000T251,000pc-1%-WP$-5%-WP$-10%-WP$ USM RQ3000T252,000pc-1%-WP$-5%-WP$-10%-WP$ USMRQ3000T255,000pc-1%-WP$-5%-WP$-10%-WP$ USMRQ3000T2510,000pc-1%-WP$-5%-WP$-10%-WP$ Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE USM P/NQuantityE-mail Delivery for packaged Resistor networks standard products is 4-6 weeks ARO. Certain items may be available from stock. For standard products available from stock, there is a minimum line item order of $250.0. Inventory is periodically updated. For 2500pc or larger orders, all surface mount packaged devices are shipped in tape on reel (T/R). For smaller quantities, it may vary. Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. On line Orders have to be verified, accepted and acknowledged by US MICROWAVES sales department in writing before, becoming non cancelable binding contracts. US MICROWAVES guarantees continuous supply and availability of any of it's standard products provided minimum order quantities are met. US MICROWAVES has made every effort to have this information as accurate as possible. However, no responsibility is assumed by US MICROWAVES for its use, nor for any infringements of rights of third parties which may result from its use. US MICROWAVES reserves the right to revise the content or modify its product line without prior notice. US MICROWAVES products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HomeProduct TreeTech. SupportPrint PDFRequest QuoteInventoryPlace OrderContact sales Last updated: US MICROWAVES www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 1990- US MICROWAVES All rights reserved. No material from this site may be used or reproduced without permission.

 
 
US MICROWAVES
Advanced Microwave Components
  CUSTOM GHz mW MICROWAVE QUARTZ THIN FILM CHIP RESISTOR
GHz mW USM RQWWLLTTT
 
 

FEATURES
APPLICATIONS
QUARTZ RESISTOR
Wide resistance range 0.1W to 91KW
Good TCR tracking
Very low capacitance value
Available in die form and shipped in waffle packs
Biasing discrete transistors circuits
Feedback resistors for amplifiers
Chip & wire hybrid circuits
Surface mount circuits
Transimpedance amplifiers
Optical communication receivers
microwave quartz thin film chip resistor RQ3000T25
Actual layout may vary

SHORT PRODUCT APPLICATION NOTE
The USM RQWWLLTTT quartz series of microwave thin film chip resistors is designed to be used in microwave hybrid circuits for biasing of active components and as feedback resistors for high speed transimpedance amplifiers. To attain very low capacitance to ground, these chip resistors are manufactured on quartz substrates and do not have backside metallization.
These devices can be used over the full military temperature range -55°C to +125°C. Quality and workmanship is per MIL-STD-883. Devices are 100% tested, visual inspected and packaged in waffle packs. US Microwaves employs proprietary thin film technologies for deposition of a wide range of sheet resistance films from 1 W/sq to 10,000 W/sq.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING
All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1W/sq to 10,000W/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

ELECTRICAL CHARACTERISTICS
PARAMETER VALUE UNITS
Resistance range 1 to 91000 W
Maxim Power 1.2 mW
Maxim Capacitance 0.04 pF
RC constant (defined for 50 W resistance) 2.00 ps
3dB frequency (defined for selected 50 W resistance) 79.55 GHz
Temperature Coefficient -55°C to 150°C 75 ppm/deg C
Tolerances available 1 %
Operating Temperature range -65 to 200 °C
Working voltage (Vw) 6.4 V
Peak voltage at 25C, 5 sec 9.1 V
Insulation resistance at 25 C 6.E+12 W
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) Resistor Bonding pads Backside metal
SiO2 - Quartz TT±1 WW x LL ±2 The resistive material is high stability Tantalum Nitride with low temperature coefficient of resistance, <75ppm/°C typical. For Rsq<10W/sq and Rsq>500W/sq, the resistive material is proprietary. The bonding pads of the resistors are min 4x4 mils, 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400C in air without loss of adhesion. The backside of the die is NOT metallized. Standard TiW/Au or other custom metallizations are available upon special request.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MTR chip resistors (5% and 10% tolerance only) are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

DIE LAYOUT - MECHANICAL SPECIFICATIONS
microwave quartz thin film chip resistor RQ3000T25
Actual layout may vary

STANDARD PRODUCTS ORDERING INFORMATION

L [mils] W [mils] Thickness [mils]
R [W] R multiplier TOLERANCE
Find part #
Note1: The first 3 digits are significant figures and the last digit specifies the number of zeros to follow (10 exponent), i.e. (nnn)x10M. If less than 4 digits, it means the absolute value, and it might include decimal point.
Note2: For different values than listed on P/N Builder above (standard EIA E192), please use the RFQ link located on the bottom of this page.

USM PART # MINIM ORDER QUANTITY Waffle Packs U/P($)
USM RQWWLLTTT-XXX-1%   -WP  
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
USM P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 06, 2009
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