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USMRQ1025T20 Quartz [SiO2] GHz Microwave Thin Film Chip Resistor GHz Microwave Thin Film Chip Resistor 20 mils Quartz SiO2 10 x 25 mils for microwave applications manufactured by US Microwaves
USMRQ1025T20 Quartz [SiO2] GHz Microwave Thin Film Chip Resistor GHz Microwave Thin Film Chip Resistor 20 mils
Quartz SiO2 10 x 25 mils for microwave applications manufactured by US Microwaves US MICROWAVES Quartz [SiO2] GHz
Microwave Thin Film Chip Resistor Advanced Microwave Components USMRQ1025T20 FEATURES APPLICATIONS GHz Microwave Thin
Film Chip Resistor Wide resistance range: 0.1Ω to 1500kΩ, 1% resistor tolerance available Good TCR tracking Low
capacitance value Low insertion loss Available in die form and shipped in waffle packs or film frame High power
dissipation while working up to GHz range frequencies High reliability and ruggedness Small chip size with reduced
stray capacitance per unit area Low temperature coefficient and wide operating temperature range Lab Kit available
Biasing discrete transistors circuits Feedback resistors for amplifiers Microwave and RF terminations Resistive
microwave dividers Wilkinson power dividers Attenuators Microwave amplifiers Transimpedance amplifiers Optical
communication receivers Chip and wire hybrid circuits Quartz [SiO2] GHz Microwave Thin Film Chip Resistor USMRQ1025T20
PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USMRQ1025T20 25x10 mils, 20 mils thickness Quartz (SiO2) microwave thin
film chip resistors series is designed to be used in microwave hybrid circuits for biasing of active components and as
feedback resistors for high speed transimpedance amplifiers for optical communication receivers. To attain very low
capacitance to ground, these chip resistors do not have backside metallization. These devices are specifically designed
and manufactured to be compatible with gold wire bonding. These devices can be used over the full military temperature
range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged
in waffle packs or film frame. US Microwaves employs proprietary thin film technologies for deposition of a wide range
of sheet resistance films from 1Ω/sq to 10,000Ω/sq. Resistors from 0.1Ω to x MΩ range are available. The resistive
material is high stability Tantalum Nitride with low temperature coefficient of resistance, <75ppm/°C typical.
TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using
advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride
resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance
and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term
stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies
for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US
Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module
applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix
Corporation. ELECTRICAL CHARACTERISTICS @25°C PARAMETER VALUE UNITS Resistance range 0.1 to 1500000 Ω Capacitance
(maximum) 0.008 pF Power dissipation 0.33 mW 3dB frequency (R=50Ω) 397.89 GHz Temperature Coefficient -55°C to 150°C 75
ppm/°C Operating Temperature range -55 to +150 °C Maximum working voltage (R=50Ω) 0.13 V Peak voltage at 25°C, 5 sec
0.18 V Insulation Resistance @25°C 1e+12 Ω RC constant (R=50Ω) 0.4 ps GHz Microwave Thin Film Chip Resistor - GENERAL
DIE INFORMATION SUBSTRATE THICKNESS [mils] DIE SIZE LxW [mils] Quartz (SiO2) 20±0.5 25x10±2 (0.64x0.25±0.05 mm)
RESISTOR BONDING PADS BACKSIDE METAL The resistive material is high stability Tantalum Nitride with low temperature
coefficient of resistance, <75ppm/°C typical. For Rsq<10Ω/sq and Rsq>500Ω/sq, the resistive material is proprietary.
The bonding pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at
400°C in air without loss of adhesion. The backside of the die is NOT metallized. Standard TiW/Au or other custom
metallizations are available upon special request. All US Microwaves products are available in die form. Typical
delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be
available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested,
visual inspected and shipped in waffle packs (WP). GHz Microwave Thin Film Chip Resistor - DIE LAYOUT & MECHANICAL
SPECIFICATIONS Quartz [SiO2] GHz Microwave Thin Film Chip Resistor USMRQ1025T20 GHz Microwave Thin Film Chip Resistor S
PARAMETERS S Parameters Quartz [SiO2] GHz Microwave Thin Film Chip Resistor USMRQ1025T20 GHz Microwave Thin Film Chip
Resistor CHIP MOUNT Quartz [SiO2] GHz Microwave Thin Film Chip Resistor USMRQ1025T20 GHz Microwave Thin Film Chip
Resistor mount GHz Microwave Thin Film Chip Resistor ASSEMBLY PROCESS - SHORT APPLICATION NOTE GHz Microwave Thin Film
Chip Resistor are designed for critical designs where space is at premium. The Alumina, Aluminum Nitride, Berillium
Oxide, Fused Silica or Silicon Microwave Thin Film Chip Resistor can ALL be die attached with conductive epoxy. AuSn or
AuGe performs can be used to die attach devices with standard backside metallization of TiW/Au. Sn or SnPb can be used
to die attach devices with standard backside metallization of Ti/Ni/Au. Ti/Pt/Au and Ti/Pd/Au are custom backside
metallizations that have the advantage of being compatible with All methods of die attaching. GHz Microwave Thin Film
Chip Resistor have metallized gold pads as terminals and they have to be attached using gold wire after the backside is
soldered in place. STANDARD PRODUCTS ORDERING INFORMATION USM P/N R [Ω] PACKAGE MIN. QTY U/P [$] ORDER STOCK QTY U/P
[$] ORDER USMRQ1025T20-500-1%-WP 50 WAFFLE PACKS 10 RFQ USMRQ1025T20-500-1%-FF 50 FILM FRAME 500 RFQ EIA-24 PART NUMBER
BUILDER TOLERANCE [%] R [Ω] Multiplier PACKAGE P/N FINDER INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING:
DELIVERY: SHIPPING/PACKAGING: SAMPLES: GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability
of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this
information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any
infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise
the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should
not be used within support systems which are intended for surgical implants into the body, to support or sustain life,
in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S.
Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact sales
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![Quartz [SiO2] GHz Microwave Thin Film Chip Resistor USMRQ1025T20 GHz Microwave Thin Film Chip Resistor mount](/res/images/chip_resistor_attach.gif "Quartz [SiO2] GHz Microwave Thin Film Chip Resistor USMRQ1025T20 GHz Microwave Thin Film Chip Resistor mount")