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USMR2000S3T10 Silicon [Si] Microwave Thin Film Chip Resistor Model S3 Piconics CxxxxE251KMS Piconics CxxxxE251JMS Piconics CxxxxE251FMS Microwave Thin Film Chip Resistor 10 mils Silicon Si 20 x 20 mils for microwave applications manufactured by US Microwaves
USMR2000S3T10 Silicon [Si] Microwave Thin Film Chip Resistor Model S3 Piconics CxxxxE251KMS Piconics
CxxxxE251JMS Piconics CxxxxE251FMS Microwave Thin Film Chip Resistor 10 mils Silicon Si 20 x 20 mils for microwave
applications manufactured by US Microwaves US MICROWAVES Silicon [Si] Microwave Thin Film Chip Resistor Model S3
Advanced Microwave Components USMR2000S3T10 FEATURES APPLICATIONS Microwave Thin Film Chip Resistor Wide resistance
range: 2.3Ω to 34.5kΩ, 1% resistor tolerance available Good TCR tracking Low capacitance value Low insertion loss
Available in die form and shipped in waffle packs or film frame High power dissipation while working up to GHz range
frequencies High reliability and ruggedness Small chip size with reduced stray capacitance per unit area Low
temperature coefficient and wide operating temperature range Lab Kit available Biasing discrete transistors circuits
Feedback resistors for amplifiers Microwave and RF terminations Resistive microwave dividers Wilkinson power dividers
Attenuators Microwave amplifiers Transimpedance amplifiers Optical communication receivers Chip and wire hybrid
circuits Silicon [Si] Microwave Thin Film Chip Resistor Model S3 USMR2000S3T10 PRODUCT DESCRIPTION AND SHORT
APPLICATION NOTE USMR2000S3T10 20x20 mils, 10 mils thickness Silicon (Si) microwave thin film chip resistors series is
designed to be used in microwave hybrid circuits for biasing of active components and as feedback resistors for high
speed transimpedance amplifiers for optical communication receivers. These devices are specifically designed and
manufactured to be compatible with gold wire bonding. These devices can be used over the full military temperature
range -55°C to +125°C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged
in waffle packs or film frame. US Microwaves employs proprietary thin film technologies for deposition of a wide range
of sheet resistance films from 1Ω/sq to 10,000Ω/sq. Resistors from 0.1Ω to x MΩ range are available. The resistive
material is high stability Tantalum Nitride with low temperature coefficient of resistance, <75ppm/°C typical.
TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using
advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride
resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance
and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term
stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies
for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US
Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module
applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix
Corporation. ELECTRICAL CHARACTERISTICS @25°C PARAMETER VALUE UNITS Resistance range 2.3 to 34500 Ω Capacitance
(maximum) 0.087 pF Power dissipation 107.79 mW 3dB frequency (R=50Ω) 36.59 GHz Temperature Coefficient -55°C to 150°C
75 ppm/°C Operating Temperature range -55 to +150 °C Maximum working voltage (R=50Ω) 2.32 V Peak voltage at 25°C, 5 sec
3.28 V Insulation Resistance @25°C 1e+12 Ω RC constant (R=50Ω) 4.35 ps Microwave Thin Film Chip Resistor - GENERAL DIE
INFORMATION SUBSTRATE THICKNESS [mils] DIE SIZE LxW [mils] Silicon (Si) 10±0.5 20x20±2 (0.51x0.51±0.05 mm) RESISTOR
BONDING PADS BACKSIDE METAL The resistive material is high stability Tantalum Nitride with low temperature coefficient
of resistance, <75ppm/°C typical. For Rsq<10Ω/sq and Rsq>500Ω/sq, the resistive material is proprietary. The bonding
pads of the resistors are 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in
air without loss of adhesion. The backside of the die is metallized with TiW/Au which is compatible with most die
attaching methods. Other metallizations are available upon special request. All US Microwaves products are available in
die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain
items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are
100% tested, visual inspected and shipped in waffle packs (WP). Microwave Thin Film Chip Resistor - DIE LAYOUT &
MECHANICAL SPECIFICATIONS Silicon [Si] Microwave Thin Film Chip Resistor Model S3 USMR2000S3T10 Microwave Thin Film
Chip Resistor S PARAMETERS S Parameters Silicon [Si] Microwave Thin Film Chip Resistor Model S3 USMR2000S3T10 Microwave
Thin Film Chip Resistor CHIP MOUNT Silicon [Si] Microwave Thin Film Chip Resistor Model S3 USMR2000S3T10 Microwave Thin
Film Chip Resistor mount Microwave Thin Film Chip Resistor ASSEMBLY PROCESS - SHORT APPLICATION NOTE Microwave Thin
Film Chip Resistor are designed for critical designs where space is at premium. The Alumina, Aluminum Nitride,
Berillium Oxide, Fused Silica or Silicon Microwave Thin Film Chip Resistor can ALL be die attached with conductive
epoxy. AuSn or AuGe performs can be used to die attach devices with standard backside metallization of TiW/Au. Sn or
SnPb can be used to die attach devices with standard backside metallization of Ti/Ni/Au. Ti/Pt/Au and Ti/Pd/Au are
custom backside metallizations that have the advantage of being compatible with All methods of die attaching. Microwave
Thin Film Chip Resistor have metallized gold pads as terminals and they have to be attached using gold wire after the
backside is soldered in place. STANDARD PRODUCTS ORDERING INFORMATION USM P/N R [Ω] PACKAGE MIN. QTY U/P [$] ORDER
STOCK QTY U/P [$] ORDER USMR2000S3T10-500-1%-WP 50 WAFFLE PACKS 10 RFQ USMR2000S3T10-500-1%-FF 50 FILM FRAME 500 RFQ
EIA-24 PART NUMBER BUILDER TOLERANCE [%] R [Ω] Multiplier PACKAGE P/N FINDER INSTANT QUOTE US Microwaves P/N Quantity
E-mail ORDERING: DELIVERY: SHIPPING/PACKAGING: SAMPLES: GUARANTEED SUPPLY! US Microwaves guarantees continuous supply
and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every
effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for
its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves
the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not
authorized for and should not be used within support systems which are intended for surgical implants into the body, to
support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific
written consent of U.S. Microwaves. Home Product Tree Tech. Support PDF Request Quote Inventory Place Order Contact
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