| Properties |
Units |
Polished
Density 996 Alum.
Oxide |
As
fired Density 996 Alum.
Oxide |
Beryllium
Oxide |
Aluminum Nitride |
Fused
Silica Quartz |
Sapphire (Crystalline) |
| Chemical Composition |
|
Al2O3 |
Al2O3 |
BeO |
AlN |
SiO2 |
Al2O3 |
| Purity |
% |
99.6 |
99.6 |
99.6 |
98 |
100 |
100 |
| Color |
|
White |
White |
White |
Tan |
Transparent |
Transparent |
| Nominal Density |
g/cm3 |
3.87 |
3.87 |
2.85 |
3.28 |
2.2 |
3.97 |
| Surface Finish
(Polished) |
m-inches |
<1.0 |
<4.0 |
2.0-4.0 |
<5.0 |
60/40 Optical |
<1.0m-inch CLA |
| Surface Finish
(As fired) |
m-inches |
n/a |
2-3 |
n/a |
n/a |
n/a |
n/a |
| Camber |
inch/inch |
.0003/.0005 |
0.002 |
.0003/.0005 |
.0003/.0005 |
.0003/.0005 |
.0003/.0005 |
| Thickness |
inches |
.004-.025* |
.005-.025* |
.005-.025* |
.004-.025* |
.004-.025* |
.004-.025* |
| Thickness Tolerance |
inches |
±0.0005 |
±0.001 |
±0.0005 |
±0.0005 |
±0.005 |
±0.000 |
| Coefficient of
Thermal Expansion (CTE) |
10-6 |
7.0-8.3 (25-1000oC) |
7.0-8.3 (25-1000oC) |
9.0 (25-1000oC) |
4.6 (25-300oC) |
0.65 (20-320oC) |
A plane @ 25oC-5.3 |
| Thermal Conductivity |
watts/m°K |
26.9 |
26.9 |
270 |
170 |
1.4 |
46 |
| Dielectric Constant |
@1MHz |
9.9±.1 |
9.9±.1 |
6.5 |
8.6 |
3.826 |
11.5/9.3† |
| Dissipation Factor
(Loss Tangent) |
@1MHz |
0.0001 |
0.0001 |
0.0004 |
0.001 |
0.000015 |
.00086/.0003† |
| Hardness |
Rockwell |
87 |
87 |
45 |
n/a |
7 Mohs |
1800/2200A Knoop |
| Flexural Strength |
K(10-3)lbs/sq.in |
90 |
90 |
35 (4 pt. bend) |
59 (4 pt. bend) |
25 |
60 |
| Compressive Strength |
M(10-3)lbs/sq.in |
54 |
54 |
n/a |
n/a |
161 |
350 |
| Grain Size |
um (microns) |
<1.0 |
<1.0 |
9-16 |
5-7 |
Amorphous |
Amorphous |
|
* Additional thickness and tolerances available upon request
† Value varies with orientation (“A” plane / “C” plane)
|
Conversion Chart |
Thermal
Conductivity |
|
TO GET |
MULTIPLY |
BY |
METALS |
|
(Watts
cm °C) |
|
Microns |
= Angstroms |
x 0.0001 |
Silver |
(Ag) |
4.08 |
|
Angstroms |
= Microns |
x 10,000 |
Copper |
(Cu) |
3.94 |
|
Millimeters |
= Microns |
x 0.001 |
Gold |
(Au) |
2.96 |
|
Microinches |
= Microns |
x 39.37 |
Aluminum |
(Al) |
2.18 |
|
Mils |
= Microns |
x 0.03937 |
Beryllium |
(Be) |
2.00 |
|
Mils |
= Millimeters |
x 39.37 |
Tungsten |
(W) |
1.74 |
|
Inches |
= Millimeters |
x 0.03937 |
Rhodium |
(Rh) |
1.50 |
|
Inches |
= Centimeters |
x 0.3937 |
Molybdenum |
(Mo) |
1.46 |
| |
|
|
Brass |
(66%Cu, 34% Zn) |
1.110 |
|
Microns |
= Microinches |
x 0.0254 |
Chromium |
(Cr) |
0.937 |
|
Mils |
= Microinches |
x 0.001 |
Nickel |
(Ni) |
0.920 |
|
Microns |
= Mils |
x 25.4 |
Platinum |
(Pt) |
0.716 |
|
Millimeters |
= Mils |
x 0.0254 |
Tin |
(Sn) |
0.666 |
|
Centimeters |
= Inches |
x 2.54 |
Tantalum |
(Ta) |
0.575 |
|
Millimeters |
= Inches |
x 25.4 |
Lead |
(Pb) |
0.353 |
| |
|
|
Titanium |
(Ti) |
0.219 |
|
Sq. Inches |
= Sq. Centimeters |
x 0.15499 |
Manganese |
(Mn) |
0.078 |
|
Sq. Centimeters |
= Sq. Inches |
x 6.45 |
|
| |
|
|
INSULATORS |
|
(Watts
cm °C) |
|
Cu. Inches |
= Cu. Centimeters |
x 0.06102 |
Diamond |
(CVD) |
10.0–16.0 |
|
Cu. Centimeters |
= Cu. Inches |
x 16.39 |
Beryllium Oxide 99.5% |
(BeO) |
2.61 |
| |
|
|
Aluminum Nitride |
(AIN) |
1.70 |
|
Ounces |
= Grams |
x 0.03527 |
Boron Nitride |
(HBN 500o) |
0.59 |
|
Pounds |
= Kilograms |
x 2.2046 |
Sapphire |
|
0.46 |
|
Grams |
= Ounces |
x 28.349 |
Alumina Oxide 99.6% |
(AI2O3) |
0.36 |
|
Kilograms |
= Pounds |
x 0.4536 |
Alumina Oxide 96% |
(AI2O3) |
0.26 |
| |
|
|
Alumina Oxide 91% |
(AI2O3) |
0.13 |
|
EQUIVALENTS |
Glass |
|
0.015 |
|
1 Angstrom |
= 1 x 10-10m |
Mica |
|
0.0043–.0062 |
|
1 Nanometer |
= 1 x 10-9m |
Air |
|
0.00026 |
|
1 Micron |
= 1 x 10-6m |
DIE
ATTACH-BONDING |
|
(Watts
cm °C) |
|
1 Microinch |
= 39.37 x 10-6m |
Gold Germanium 88/12 |
0.8834 |
|
1 Microinch |
= 1 x 10-6m |
Gold Tin 80/20 |
0.6824 |
|
1 Millimeter |
= 1 x 10-3m |
Tin Lead Solder (Sn62) |
0.4921 |
| TEMPERATURE |
Indium 100% |
0.2386 |
| Degrees F |
= 9/5 (Degrees C) + 32 |
Silver Filled Epoxy |
0.0156 |
| Degrees C |
= 5/9 (Degrees F) – 32 |
Epoxy |
0.0099 |
|
|
|
|
|
|
|
|
|
SOLDERING TO GOLD - ALLOY CHOICE
The following indium alloys can be used
successfully against gold without the harmful effects caused when tin
bearing alloys are used:
| Composition |
Melting
Temperature (Liquidus
/ Solidus) |
Product |
| 97In-3Ag |
143°C E |
Indalloy 290 |
| 80In-15Pb-5Ag |
154°C / 149°C |
Indalloy 2 |
| 100In |
157°C MP |
Indalloy 4 |
| 70In-30Pb |
175°C / 165°C |
Indalloy 204 |
| 60In-40Pb |
181°C / 173°C |
Indalloy 205 |
| 50In-50Pb |
210°C / 178°C |
Indalloy 7 |
| 60Pb-40In |
231°C / 197°C |
Indalloy 206 |
| 90In-10Ag |
237°C / 141°C |
Indalloy 3 |
| 75Pb-25In |
266°C / 240°C |
Indalloy 1 |
| 81Pb-19In |
275°C / 260°C |
Indalloy150 |
| 90Pb-5In-5Ag |
310°C / 290°C |
Indalloy12 |
| 92.5Pb-5In-2.5Ag |
310°C / 300°C |
Indalloy164 |
| 95Pb-5In |
313°C / 300°C |
Indalloy11 |
|
|
Other SOLDERS Composition |
Melting Temperature °C |
|
52In-48Sn |
118 |
| 52Bi-48Sn |
138 |
| 97In-3Ag |
143 |
| 91Sn-9Zn |
199 |
| 91.2Sn-8.8Zn |
199/199 |
|
89Sn-8.0Zn-3.0Bi |
197/187 |
|
95Sn-5Sb |
235/240 |
| 42Sn-58Bi |
138/138 |
| 63Sn-37Pb |
183/183 |
| Sn/Ag/Cu |
217-218 |
| 93.6Sn-4.7Ag-1.7Cu |
217 |
| 96.5Sn-3.0Ag-0.5Cu |
219/217 |
| 95.5Sn-3.8Ag-0.7Cu(Indalloy 241) |
217 |
| 95.2Sn-3.8Ag-1.0Cu (SN96CI) |
217 |
|
95.5Sn-4Ag-0.5Cu (Indalloy
246) |
217 |
| 95.5Sn-3.9Ag-0.6Cu (Indalloy 252) |
217 |
| Sn/Ag/Cu(/Sb) |
215-217 |
| 96.3Sn-2.5Ag-0.7Cu-0.5Sb(Castin) |
210/217 |
| 65Sn-25Ag-10Sb |
233 |
| 97Sn-3Cu |
227-300 |
| 99.3Sn-0.7Cu (Indalloy 244) |
229 |
| 96Sn-4Ag |
is a fairly common alloy with a long history in
the hybrid circuit industry |
| 96.5Sn-3.5Ag (Indalloy 121) |
221 |
| 93Sn-3.5Ag-3.0In-0.5Bi |
214/190 |
|
91.4Sn-3.2Ag-2.7In-2.7Bi |
210/190 |
| 87.5Sn-3.5Ag-6.0In-3.0Bi |
206/165 |
| 92Sn-3.5Ag-4.0In-0.5Bi |
211/190 |
| 91.8Sn-3.4Ag-4.8Bi (Indalloy 249) |
205/210 |
| 92.5Sn-3.5Ag-1.0Cu-3Bi(LF-C2) |
208/213 |
| 77.2Sn-20In-2.8Ag (Indalloy 227) |
175-187 |
|
Potentially Problematic
Elements
- Zinc
- corrosivity, oxidation, ease of use
- Cadmium - toxicity, WEEE directive
- Gallium - supply,
costs, brittleness
- Bismuth - embrittlement,
secondary eutectic of 96C formed if exposed to lead.
- Indium - cost,
supply, poor resistance to corrosion and rapid oxide
formation during melting.
- Lead - toxicity
|
MATERIAL |
CONDUCTIVITY |
MATERIAL |
CONDUCTIVITY |
MATERIAL |
CONDUCTIVITY |
| |
(Mho/meter) x 10 |
|
(Mho/meter) x 10 |
|
(Mho/meter) x 10 |
|
Tantalum
Nitride
|
0.000074
|
Palladium
|
0.0926
|
Brass (66%Cu,
34%Zn) |
0.2564
|
|
Carbon
|
0.0006–0.0007
|
Indium
|
0.1111
|
Aluminum
|
0.3817
|
|
Nichrome (80%Ni,
20%Cr)
|
0.0093
|
Nickel
|
0.1449
|
Gold
|
0.4098
|
|
Lead
|
0.047
|
Tungsten
|
0.184
|
Copper
|
0.5800
|
|
Sn63
Solder
|
0.0667
|
Rhodium
|
0.1961
|
Silver
|
0.6173
|
|
Tin
|
0.087
|
Beryllium
|
0.2188 |
|
|
|
| FUSING
CURRENT [A] of 99.99% GOLD WIRE |
| Wire diameter |
Wire
length (mm) |
| (mil) |
1 |
2 |
3 |
5 |
10 |
10 |
| 0.8 |
1.74 |
0.87 |
0.58 |
0.35 |
0.17 |
0.39 |
| 1.0 |
2.71 |
1.36 |
0.90 |
0.54 |
0.27 |
0.52 |
| 1.2 |
3.91 |
1.95 |
1.30 |
0.78 |
0.39 |
0.67 |
| 1.3 |
4.73 |
2.36 |
1.58 |
0.95 |
0.48 |
0.73 |
| 1.5 |
6.27 |
3.13 |
2.09 |
1.26 |
0.62 |
N/A |
| 2.0 |
10.85 |
5.43 |
3.62 |
2.17 |
1.08 |
N/A |
| |
Note 1 |
Note 2 |
| Note1: Obtained from calculation
according to IEEE (Threshold time : 10sec) |
| Note 2: Obtained from
experiment (Threshold time : 5sec) |
| Remark : As experimental fusing current
is higher than calculated fusing current as shown at above table,
it is better to use fusing current from calculation in consideration
of safety design. |
|
| Electrical characteristic of 4N(99.99%)
gold wire sample length 10mm, room temperature in the air |
| Wire size vs. Electrical resistance |
| Wire size [mils] |
0.8 |
1.0 |
1.2 |
1.4 |
1.6 |
1.8 |
2.0 |
2.2 |
2.4 |
2.6 |
2.8 |
2.9 |
| Electrical resistance [ohms] |
0.150 |
0.090 |
0.060 |
0.047 |
0.037 |
0.035 |
0.022 |
0.020 |
0.017 |
0.016 |
0.015 |
0.015 |
|