LM317 die equivalent, The USM LM317 is an adjustable three-terminal positive voltage regulator capable of supplying in excess of 500 mA over an output voltage range of 1.2 V to 37 V. This voltage regulator is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, it employs internal current limiting, thermal shutdown and safe area compensation, making it essentially blow-out proof. The USM317 serves a wide variety of applications including local, on-card regulation. This device also makes an especially simple adjustable switching regulator, a programmable output regulator, or by connecting a fixed resistor between the adjustment and output, the USM317 cam be used as a precision current regulator.

 
 
US MICROWAVES
Advanced Microwave Components
  THREE-TERMINAL ADJUSTABLE OUTPUT POSITIVE VOLTAGE REGULATOR
USM LM317
 
 

FEATURES
APPLICATIONS
VOLTAGE REGULATOR
Output Current in Excess of 500mA
Output Adjustable between 1.2V and 37V
Internal Thermal Overload Protection
Internal Short Circuit Current Limiting
Output Transistor Safe-Area Compensation
Floating Operation for High Voltage Applications
In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS.

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE
The USM LM317 is an adjustable three-terminal positive voltage regulator capable of supplying in excess of 500 mA over an output voltage range of 1.2 V to 37 V. This voltage regulator is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, it employs internal current limiting, thermal shutdown and safe area compensation, making it essentially blow-out proof. The USM317 serves a wide variety of applications including local, on-card regulation. This device also makes an especially simple adjustable switching regulator, a programmable output regulator, or by connecting a fixed resistor between the adjustment and output, the USM317 cam be used as a precision current regulator.


IC SCHEMATIC DIAGRAM

MAXIMUM RATINGS
PARAMETER SYMBOL VALUE UNITS
Input-Output Voltage Differential VI - VO 40 Vdc
Operating Ambient Temperature Range TJ -40 to +125 °C
Storage Temperature Range Tstg -65 to +150 °C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

ELECTRICAL CHARACTERISTIC
55C<Tj<+150C, Vi = 14V, Io = 550mA, Ci = 0.33F, Co= 0.1F, unless otherwise specified
PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS
Line Regulation (Note 2)
TA=25°C, 3.0V =< VI-VO =< 40V
Regline   0.01 0.04 %/V
Line Regulation (Note 2)
TA=25°C, 10mA =< IO =<0.5A
VO=< 5.0V
VO =>5.0V
Regload  
5.0
0.1

25
0.5

mV %VO
Adjustment Pin Current
IAdj   50 100 µA
Adjustment Pin Current Change
2.5V =< VI-VO=< 40V,
10mA =< IL =< 0.5A, PD =< Pmax
DIAdj   0.2
5.0
µA
Reference Voltage
3.0V =< VI-VO=< 40V,
10mA =< IL =< 0.5A, PD =< Pmax
Vref 1.200
1.250
1.300
V
Line Regulation (Note 2)
3.0V =< VI-VO=< 40V,
Regline   0.02 0.07 %/V
Load Regulation (Note 2)
10mA =< IO =< 0.5A
VO =< 5.0V
VO =>5.0V
Regload  
20
0.3

70
1.5

mV
%VO
Temperature Stability
Tlow =< TJ =< Thigh
TS   0.7   %VO
Minimum Load Current to Maintain Regulation
VI-VO = 40V
ILmin   3.5 10 mA
Maximum Output Current
VI-VO =< 15V, PD =< Pmax
VI-VO =< 15V, PD =< Pmax, TA=25°C
Imax 0.5
0.15
0.9
0.25
  A
RMS Noise, % of VO
TA=25°C, 10 Hz
N   0.003   % VO
Ripple Rejection
VO = 10 V, f = 120 Hz (Note 3)
Without CAdj
CAdj = 10 mF
RR
-
66

65
80
  dB

Long-Term Stability, TJ = Thigh (Note 4)
TJ = Thigh (Note 4)
TA=25°C for Endpoint Measurements
S   0.3
1.0
%1.0k Hrs.
 
(NOTE 1) Tlow to Thigh = 0°C for USM LM317
(NOTE 2) Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used.
(NOTE 3) CAdj, when used, is connected between the adjustment pin and ground.
(NOTE 4) Since Long-Term Stability cannot be measured on each device before shipment, this specification is an engineering estimated of average stability from lot to lot.


GENERAL DIE INFORMATION
Substrate Thickness (mils) Die size (mils) [mm] Bonding pads Backside metal
Silicon 10±1 (96.457x72.835)[2.45x1.85] min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5m GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For high volume automated assembly, MIS chip capacitors are supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-MANUFACTURING
These integrated Circuits are manufactured with medium voltage junction isolated bipolar process. junction isolated bipolar processes allow integration of high performance NPN, PNP and JFET transistors, MOS capacitors, diffused resistors and precision thin film resistors. The bond pad metallization is standard 1m Aluminium. The backside of the die is coated with 0.5m GOLD , which makes it compatible with AuSi or AuGe die attach.
All US Microwaves products are manufactured using GOLDCHIP TECHNOLOGY™ a trade mark of Semiconix Corporation.

DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD # FUNCTION X(mils) X(mm) Y(mils) Y(mm)
1 ADJ 83.465 2.120 16.142 0.410
2 OUTPUT 68.110 1.730 58.661 1.490
3 INPUT 44.094 1.120 37.402 0.950
4 OUTPUT 3.543 0.090 3.937 0.100
           
 

STANDARD PRODUCTS ORDERING INFORMATION

STANDARD PRODUCTS PRICE LIST
USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($)
USM7905 $320/100pc. -WP $3.20
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by US MICROWAVES at any time and without notice.
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.

INSTANT QUOTE
US Microwaves P/N Quantity E-mail    
 

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.

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Last updated: July 01, 2009
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