Heat sinks, isolated and ellectrically conductive heat sinks and stand offs on AlN Aluminium Nitride, BeO Beryllium Oxide, Si Silicon and Cu Copper , zero ohm jumpers, bonding island manufactured by US Microwaves - Thin film microwave and RF products Heat sinks, stand offs, bonding islands, zero ohm jumpers, isolated, electrically conductive,aluminum nitride, beryllium oxide, silicon, quartz, glass, alumina ceramic, Thin Film Microwave Circuits HSKALNI05xxxyyy 5 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNI10xxxyyy 10 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNI15xxxyyy 15 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNI20xxxyyy 20 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNI25xxxyyy 25 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNI30xxxyyy 30 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNI35xxxyyy 35 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNI40xxxyyy 40 mils Aluminium Nitride Isolated submounts and heat sink gold tin HSKALNC05xxxyyy 5 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNC10xxxyyy 10 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNC15xxxyyy 15 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNC20xxxyyy 20 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNC25xxxyyy 25 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNC30xxxyyy 30 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNC35xxxyyy 35 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNC40xxxyyy 40 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin HSKALNI05xxxyyy 5 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI10xxxyyy 10 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI15xxxyyy 15 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI20xxxyyy 20 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKALNI25xxxyyy 25 mils thick gold coated thin film Aluminium Nitride Isolated heat sinks HSKBEOI05xxxyyy 5 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI10xxxyyy 10 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI15xxxyyy 15 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI20xxxyyy 20 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKBEOI25xxxyyy 25 mils thick gold coated thin film Beryllium Oxide Isolated heat sinks HSKSII05xxxyyy 5 mils thick gold coated thin film Silicon Isolated heat sinks HSKSII10xxxyyy 10 mils thick gold coated thin film Silicon Isolated heat sinks HSKSII15xxxyyy 15 mils thick gold coated thin film Silicon Isolated heat sinks HSKSII20xxxyyy 20 mils thick gold coated thin film Silicon Isolated heat sinks HSKSII25xxxyyy 25 mils thick gold coated thin film Silicon Isolated heat sinks HSKALNC05xxxyyy 5 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks HSKALNC10xxxyyy 10 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks HSKALNC15xxxyyy 15 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks HSKALNC20xxxyyy 20 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks HSKALNC25xxxyyy 25 mils thick gold coated thin film Aluminium Nitride Electrically Conductive heat sinks HSKBEOC05xxxyyy 5 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks HSKBEOC10xxxyyy 10 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks HSKBEOC15xxxyyy 15 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks HSKBEOC20xxxyyy 20 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks HSKBEOC25xxxyyy 25 mils thick gold coated thin film Beryllium Oxide Electrically Conductive heat sinks HSKSIC05xxxyyy 5 mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC10xxxyyy 10 mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC15xxxyyy 15 mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC20xxxyyy 20 mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKSIC25xxxyyy 25 mils thick gold coated thin film Silicon Electrically Conductive heat sinks HSKCUC05xxxyyy 5 mils thick gold coated thin film Copper Electrically Conductive heat sinks HSKCUC10xxxyyy 10 mils thick gold coated thin film Copper Electrically Conductive heat sinks Heat sinks, stand offs, bonding islands, zero ohm jumpers, isolated or electrically conductive, manufactured on aluminum nitride, beryllium oxide, silicon, quartz, glass or alumina ceramic.US MICROWAVES, manufacturer of high reliability microwave integrated circuits  MIC technology. US Microwave offers a multitude of applied thin film products and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices  for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.SEMICONIX Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through holle and surface mounted packages. SEMICONWELL is suppling integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.

 

logo: US Microwaves Advanced Microwave Components
US MICROWAVES
Advanced Microwave Components
ALUMINUM NITRIDE, BERYLLIUM OXIDE, SILICON, COPPER - SUBMOUNTS, HEAT SINKS, STAND OFFS, BONDING ISLANDS,0 OHM JUMPERS
 
ALUMINUM NITRIDE SUBMOUNTS GOLD TIN - ISOLATED
 
HSKALNI05xxxyyy5 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI10xxxyyy10 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI15xxxyyy15 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI20xxxyyy20 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI25xxxyyy25 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI30xxxyyy30 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI35xxxyyy35 mils Aluminium Nitride Isolated submounts and heat sink gold tin
HSKALNI40xxxyyy40 mils Aluminium Nitride Isolated submounts and heat sink gold tin
 
ALUMINUM NITRIDE SUBMOUNTS GOLD TIN - ELECTRICALLY CONDUCTIVE
 
HSKALNC05xxxyyy5 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC10xxxyyy10 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC15xxxyyy15 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC20xxxyyy20 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC25xxxyyy25 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC30xxxyyy30 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC35xxxyyy35 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
HSKALNC40xxxyyy40 mils Aluminium Nitride Electrically Conductive submounts and heat sink gold tin
 
ALUMINUM NITRIDE, BERYLLIUM OXIDE, SILICON ISOLATED HEAT SINKS
 
HSKALN-XXXX-TT THICK GOLD COATED THIN FILM ALUMINIUM NITRIDE ISOLATED HEAT SINKS AND STAND OFFS
HSKBEO-XXXX-TT THICK GOLD COATED THIN FILM BERYLLIUM OXIDE ISOLATED HEAT SINKS AND STAND OFFS
HSKSII-XXXX-TT THICK GOLD COATED THIN FILM SILICON ISOLATED HEAT SINKS AND STAND OFFS
 
ALUMINUM NITRIDE, BERYLLIUM OXIDE, SILICON, COPPER ELECTRICALLY CONDUCTIVE HEAT SINKS
 
HSKALNC-XXXX-TT THICK GOLD COATED THIN FILM ALUMINIUM NITRIDE ELECTRICALLY CONDUCTIVE HEAT SINKS AND STAND OFFS
HSKBEOC-XXXX-TT THICK GOLD COATED THIN FILM BERYLLIUM OXIDE ELECTRICALLY CONDUCTIVE HEAT SINKS AND STAND OFFS
HSKSIC-XXXX-TT THICK GOLD COATED THIN FILM SILICON ELECTRICALLY CONDUCTIVE HEAT SINKS AND STAND OFFS
HSKCU-XXXX-TT THICK GOLD COATED THIN FILM COPPER ELECTRICALLY CONDUCTIVE HEAT SINKS AND STAND OFFS

 

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