Spiral chip inductors,high quality factor, high self resonance frequency microwave inductors,high SRF thin film inductors, quarter turn, wire bond tuned,flip chip,solder bals, gold stud bumped spiral coils,lab kits,custom inductors 1 turn to 21 turns, 1nH to 256nH HIGH Q and HIGH SELF RESONANCE MICROWAVE SPIRAL CHIP INDUCTORS, LX5000, LX3000, LX2500 SERIES CHIP SCALE, FLIP CHIP, MULTITAP MULTI TAP 1/4 TURN TUNABLE LXT5000, LXT3000, LXT2500 SPIRAL CHIP INDUCTORS, ASSEMBLY of CHIP SCALE SPIRAL CHIP INDUCTORS, SPIRAL CHIP INDUCTORS DESIGN MODELING OVERVIEW, SPIRAL INDUCTORS OPTIMIZATION, ON CHIP RF TRANSFORMERS DESIGN MODELING OVERVIEW,SPIRAL INDUCTORS WIRE BONDING DIE ATTACH, CUSTOM SPIRAL CHIP INDUCTORS, FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP, CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP, SPIRAL CHIP INDUCTORS INVENTORY STOCK HIGH Q & HIGH SELF RESONANCE MICROWAVE SPIRAL CHIP INDUCTORS LX5000Q20-XXX - HIGH Q FACTOR SPIRAL CHIP INDUCTORS 50x50 MILS LX3000Q20-XXX - HIGH Q FACTOR SPIRAL CHIP INDUCTORS 30x30 MILS LX2500Q20-XXX - HIGH Q FACTOR SPIRAL CHIP INDUCTORS 25x25 MILS LX3000Q20NH-XXX - 1nH TO 10nH, 30x30 MILS, HIGH Q SPIRAL CHIP INDUCTORS LX2500Q20NH-XXX - 1nH TO 10nH, 25x25 MILS HIGH Q SPIRAL CHIP INDUCTORS LXT5000Q20-XXX - MULTI TAP 1/4 TURN TUNING SPIRAL CHIP INDUCTORS LXT3000Q20-XXX - MULTI TAP 1/4 TURN TUNING SPIRAL CHIP INDUCTORS LXT2500Q20-XXX - MULTI TAP 1/4 TURN TUNING SPIRAL CHIP INDUCTORS LX5000Q20FC-XXX - HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP LX3000Q20FC-XXX - HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP LX2500Q20FC-XXX - HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP LX3000Q20NHFC-XXX - 1nH TO 10nH HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP LX2500Q20NHFC-XXX - 1nH TO 10nH HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP LXT5000Q20FC-XXX - FLIP CHIP MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS LXT3000Q20FC-XXX - FLIP CHIP MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS LXT2500Q20FC-XXX - FLIP CHIP MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS LX5000Q20CSP-XXX - HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP LX3000Q20CSP-XXX - HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP LX2500Q20CSP-XXX - HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP LX3000Q20NHCSP-XXX - 1nH TO 10nH HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP LX2500Q20NHCSP-XXX - 1nH TO 10nH HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP LXT5000Q20CSP-XXX - CHIP SCALE MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS LXT3000Q20CSP-XXX - CHIP SCALE MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS LXT2500Q20CSP-XXX - CHIP SCALE MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS AN 102 - SPIRAL INDUCTORS WIRE BONDING DIE ATTACH AN 105 - SPIRAL CHIP INDUCTORS DESIGN MODELING OVERVIEW AN 106 - HIGH Q CIRCULAR SPIRAL INDUCTORS OPTIMIZATION AN 112 CHIP SCALE / FLIP CHIP GOLD STUD BUMPED SPIRAL CHIP INDUCTORS AN 113 ASSEMBLY of CHIP SCALE SPIRAL CHIP INDUCTORS AN 116 ON CHIP RF TRANSFORMERS DESIGN MODELING OVERVIEW SPIRAL CHIP INDUCTORS LAB KITS CUSTOM SPIRAL CHIP INDUCTORS SPIRAL CHIP INDUCTORS INVENTORY Spiral chip inductors are available in 3 different die dimensions: - For 1 turn to 21 turns series the die size is 0.050"x0.050"x0.020". - For 1 turn to 12 turns the die size is 0.030"x0.030"x0.020". - For 1 turn to 8 turns the die size is 0.025"x0.025"x0.020". Chip Scale spiral chip inductors have no parasitic inductance because there are no additional wire bonds. -Simple mounting by thermo compression or with conductive epoxy. -Transparent substrate allows flip chip mounting without specialized equipment. -Compatible with various substrates. Spiral chip inductors are manufactured on quartz (SiO2), 20 mils thick, for lowest capacitance and highest SRF and PRF. These devices can be used over the full military temperature range -55C to +125C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. Spiral Chip Inductors Lab kits are available from stock: L-Kit Flip chip series of spiral chip inductors are designed to be used in chip and wire hybrid circuits as RF choke in biasing circuits, microwave circuit resonant elements and power supplies. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. US Microwaves advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25m, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. For lowest capacitance and higher self-resonance, the spiral chip inductors are manufactured on 20 mil thick quartz (SiO2) substrates. Chip scale, flip chip spiral inductors eliminate up to 3nH of parasitic inductance associated with the gold wires used for the standard series LX5000Q20FC-L04-08nH. Eliminating the parasitic inductance improves inductor performance, self-resonance, precision and operability in the high gigahertz range applications. Flip chip spiral chip inductors are easily mounted by thermo compression or conductive epoxy. The ability to be attached with conductive epoxy opens the possibility of using these high Q and ultra high self-resonance inductors on other substrates than gold-coated thin film on ceramic circuits. The fact that the substrate is transparent fused silica is a bonus feature that helps in flip chip mounting operation without sophisticated and expensive equipment. Application notes AN 102, AN 112 and AN 113 are describing assembly methods for best performance. Manufactured with 99.9% pure gold, the spiral inductor chip does not need any protection and can operate even in hostile environments. Designed and manufactured by US Microwaves in 1990 for military and industrial applications, the spiral chip inductors now can find their place in optoelectronic and wireless consumer products as well. US MICROWAVES, manufacturer of high reliability microwave integrated circuits  MIC technology. US Microwave offers a multitude of applied thin film products and microwave semiconductor devices: manufactures and supplies high quality standard microwave thin film circuits and microwave devices using advanced technical ceramics and semiconductor materials; Products include RF micro devices  for hybrid chip and wire applications; microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky diodes, PIN diodes, tunnel diodes, SRD diodes, varactor diodes and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.SEMICONIX Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through holle and surface mounted packages. SEMICONWELL is suppling integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.

 


US MICROWAVES
Advanced Microwave Components
HIGH Q & HIGH SELF RESONANCE MICROWAVE SPIRAL CHIP INDUCTORS
 
LX5000Q20-XXX - HIGH Q FACTOR SPIRAL CHIP INDUCTORS 50x50 MILS
LX3000Q20-XXX - HIGH Q FACTOR SPIRAL CHIP INDUCTORS 30x30 MILS
LX2500Q20-XXX - HIGH Q FACTOR SPIRAL CHIP INDUCTORS 25x25 MILS
 
LX3000Q20NH-XXX - 1nH TO 10nH, 30x30 MILS, HIGH Q SPIRAL CHIP INDUCTORS
LX2500Q20NH-XXX - 1nH TO 10nH, 25x25 MILS HIGH Q SPIRAL CHIP INDUCTORS
 
LXT5000Q20-XXX - MULTI TAP 1/4 TURN TUNING SPIRAL CHIP INDUCTORS
LXT3000Q20-XXX - MULTI TAP 1/4 TURN TUNING SPIRAL CHIP INDUCTORS
LXT2500Q20-XXX - MULTI TAP 1/4 TURN TUNING SPIRAL CHIP INDUCTORS
 
LX5000Q20FC-XXX - HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP
LX3000Q20FC-XXX - HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP
LX2500Q20FC-XXX - HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP
 
LX3000Q20NHFC-XXX - 1nH TO 10nH HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP
LX2500Q20NHFC-XXX - 1nH TO 10nH HIGH Q FLIP CHIP SPIRAL INDUCTORS - GOLD STUD BUMP
 
LXT5000Q20FC-XXX - FLIP CHIP MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS
LXT3000Q20FC-XXX - FLIP CHIP MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS
LXT2500Q20FC-XXX - FLIP CHIP MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS
 
LX5000Q20CSP-XXX - HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP
LX3000Q20CSP-XXX - HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP
LX2500Q20CSP-XXX - HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP
 
LX3000Q20NHCSP-XXX - 1nH TO 10nH HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP
LX2500Q20NHCSP-XXX - 1nH TO 10nH HIGH Q CHIP SCALE SPIRAL INDUCTORS - GOLD STUD BUMP
 
LXT5000Q20CSP-XXX - CHIP SCALE MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS
LXT3000Q20CSP-XXX - CHIP SCALE MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS
LXT2500Q20CSP-XXX - CHIP SCALE MULTI TAP 1/4 TURN TUNING SPIRAL INDUCTORS
 
AN 102 - SPIRAL INDUCTORS WIRE BONDING DIE ATTACH
AN 105 - SPIRAL CHIP INDUCTORS DESIGN MODELING OVERVIEW
AN 106 - HIGH Q CIRCULAR SPIRAL INDUCTORS OPTIMIZATION
 
AN 112 CHIP SCALE / FLIP CHIP GOLD STUD BUMPED SPIRAL CHIP INDUCTORS
AN 113 ASSEMBLY of CHIP SCALE SPIRAL CHIP INDUCTORS
AN 116 ON CHIP RF TRANSFORMERS DESIGN MODELING OVERVIEW
 
SPIRAL CHIP INDUCTORS LAB KITS
CUSTOM SPIRAL CHIP INDUCTORS
SPIRAL CHIP INDUCTORS INVENTORY
 
   
 
Spiral chip inductors are available in 3 different die dimensions:
- For 1 turn to 21 turns series the die size is 0.050"x0.050"x0.020".
- For 1 turn to 12 turns the die size is 0.030"x0.030"x0.020".
- For 1 turn to 8 turns the die size is 0.025"x0.025"x0.020".
Chip Scale spiral chip inductors have no parasitic inductance because there are no additional wire bonds.
-Simple mounting by thermo compression or with conductive epoxy.
-Transparent substrate allows flip chip mounting without specialized equipment.
-Compatible with various substrates.
Spiral chip inductors are manufactured on quartz (SiO2), 20 mils thick, for lowest capacitance and highest SRF and PRF.
These devices can be used over the full military temperature range -55C to +125C. Quality and workmanship is per MIL-S-883. Devices are 100% tested, visual inspected and packaged in waffle packs. Spiral Chip Inductors Lab kits are available from stock: L-Kit
Flip chip series of spiral chip inductors are designed to be used in chip and wire hybrid circuits as RF choke in biasing circuits, microwave circuit resonant elements and power supplies. When used as chokes, a modest Q is desirable while in oscillators Q has to be as high as possible. US Microwaves advanced thin film technologies allow for an important reduction of the DCR max, which translates into an increased Q. For spirals with w+s=25m, Q values between 25 and 30 are obtained which represent a better compromise between the two applications. For lowest capacitance and higher self-resonance, the spiral chip inductors are manufactured on 20 mil thick quartz (SiO2) substrates.
Chip scale, flip chip spiral inductors eliminate up to 3nH of parasitic inductance associated with the gold wires used for the standard series LXxxxx/LXTxxxx. Eliminating the parasitic inductance improves inductor performance, self-resonance, precision and operability in the high gigahertz range applications. Flip chip spiral chip inductors are easily mounted by thermo compression or conductive epoxy. The ability to be attached with conductive epoxy opens the possibility of using these high Q and ultra high self-resonance inductors on other substrates than gold-coated thin film on ceramic circuits. The fact that the substrate is transparent fused silica is a bonus feature that helps in flip chip mounting operation without sophisticated and expensive equipment.
Application notes AN 102, AN 112 and AN 113 are describing assembly methods for best performance. Manufactured with 99.9% pure gold, the spiral inductor chip does not need any protection and can operate even in hostile environments.
Designed and manufactured by US Microwaves in 1990 for military and industrial applications, the spiral chip inductors now can find their place in optoelectronic and wireless consumer products as well.

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